Silicon production is growing rapidly worldwide, and with the ever-increasing demand for processing capabilities for artificial intelligence, the trend does not seem likely to slow down.

This evolution has led to an increase in the supply of solutions for the thermal management of electronic devices. Among these, a crucial role is played by the thermally conductive compounds, materials designed to optimize heat transfer and ensure stable operating temperatures.

A good thermal conductive paste should ensure high thermal conductivity, reduce the phenomenon of pump-out and withstand high temperatures, preventing overheating problems and improving the reliability of electronic devices.

The main heat management strategies

There are several cooling techniques used to dissipate the heat generated by electronic components:

• Convection: transfers heat from the surface of the device to a coolant, by natural, forced or mixed convection.
• Thermal driveways: holes in the heat sink plates that channel heat away from the components.
• Air cooling: the most common method, using heat sinks.
• Liquid cooling: a cold fluid absorbs heat and dissipates it through a heat exchanger, used in high-performance systems.
• Heat Pipe (EHP and PHP): advanced heat diffusers that improve thermal conductivity and reduce chip temperature.

All these strategies are designed to prevent thermal runaway, a phenomenon in which excessive heat generated exceeds the cooling capacity of the system, leading to failure or damage.

DOWSIL TC-5960: an advanced solution for heat dissipation

The DOWSIL TC-5960 is a thermally conductive compound formulated with thermally conductive fillers in a matrix of silicone, designed to offer high thermal conductivity and strong pump-out resistance.

Key Features

• High thermal conductivity For efficient cooling.
• Resistance to pump-out, ideal for bare mold applications.
• Thixotropic material with high temperature stability.
• One-component formulation that does not require polymerization.
• Solvent-free, ensuring stability after the container is opened.
• Easy application, compatible with screen printing, stencil printing and dispensing.
• Low thermal resistance and thin Bond Line Thickness (BLT) To maximize heat transfer.

DOWSIL TC-5960: composition and applications

The DOWSIL TC-5960 is composed of thermally conductive charges dispersed in a siloxane polymer matrix., making it suitable for use in PCB systems, heat sinks and chassis.

Due to its properties, it is used for the cooling of electronic modules, particularly in consumer devices, where increasing miniaturization makes thermal management increasingly complex.

Related products you can find on the site

• DOWSIL™ SC 102 Compound: thermally conductive silicone compound with high thermal stability, ideal for heat dissipation in electronic components.
• Electrolube HTSP – Silicone Heat Transfer Compound Plus: Silicone-based thermal paste with high thermal conductivity, perfect for critical applications.
• Electrolube RTV – Thermally Conductive Oxime: Thermally conductive RTV sealant that provides adhesion and heat dissipation in electronic devices.

Discover the right product for your application

To ensure high performance and increased reliability in electronic devices, the choice of a thermal conductive paste effective is critical. DOWSIL TC-5960 offers high thermal conductivity, ease of application and pump-out resistance, providing a reliable solution for heat dissipation. Learn about all types of thermal conductive pastes and contact our Macsherpa team to find out which ones are best suited for your applications.