Dow at Bondexpo 2018 in Stuttgart.
International exhibition for adhesive technology
Our partner Dow is exhibiting at Bondexpo 2018 in Stuttgart, Oct. 8-11. Bondexpo has established itself as a global reference and meeting point for industry users. It represents the entire assembly and adhesion process chain, offering solutions for practical applications and anticipating future challenges for the industry.
Visit the DOW booth (HALL 6, BOOTH 6522) at Bondexpo and learn how we can help you find innovative solutions. With Dow’s silicones, you can solve your design and production challenges.
Let’s Bond Together – We Have Your Ticket
On behalf of Dow, we want you to be our special guest and offer you a free admission ticket to the 12th Bondexpo in Stuttgart, Germany, October 8-11. Since the amount of free tickets is limited, do not hesitate.
Dowsil adhesives meet the most complex application needs, such as:
- Resistance to high temperatures
- Solvent resistance
- High production speeds
- Optical clarity
- Energy saving
- High initial force
- Thermal management
- Food contact
