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Mascherpa s.p.a
🧭 Where you are: mascherpa.it » Dowsil electronics

Dowsil electronics

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Product type

  • 10 Conformal coating
  • 16 Electronics adhesive
  • 2 Gap filler
  • 6 Gel
  • 10 Heat-conductive adhesive
  • 4 Resins and encapsulants
  • 1 Thermal conductive paste

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Applications

  • DOWSIL™ 1-2577 Conformal Coating
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    DOWSIL™ 1-2577 Conformal Coating

    • Cures to an elastoplastic surface
    • Resilient and abrasion resistant
    • Single-component solvent-based resin coating
    • Polymerization at room temperature
    • It can speed up in-line processing
    • UV indicator enables automatic inspection
    • Allows use with many low-solids lead-free solder
  • DOWSIL™ 1-2577 Low VOC Conformal Coating
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    DOWSIL™ 1-2577 Low VOC Conformal Coating

    • Cures to an elastoplastic surface
    • Resilient and abrasion resistant
    • Solvent-based resin coating
    • Polymerization at room temperature
    • The optional thermal acceleration (after solvent wilting)
    • UV indicator enables automated inspection
    • Allows use with many low-solids lead-free solder
    • Reduced VOC content
    • Emission recovery can be simplified for VOCs in some U.S. states
  • DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
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    DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating

    • Cures to a robust surface
    • Resilient and abrasion resistant
    • Solvent-based resin coating
    • Polymerization at room temperature
    • Possibility of acceleration after solvent spillage
    • UV indicator for inspection
    • Allows use with many low-solids lead-free solder
    • Low viscosity improves flow and
    • fill tight spaces and gaps
  • DOWSIL™ 1-2620 Low VOC Conformal Coating
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    DOWSIL™ 1-2620 Low VOC Conformal Coating

    • Medium viscosity
    • Low VOC content
    • Abrasion resistance
    • Good dielectric properties
    • Good adhesion to many substrates
    • Polymerization at room temperature
    • Stable and flexible over a wide temperature range
  • DOWSIL™ 1-4173 Thermally Conductive Adhesive
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    DOWSIL™ 1-4173 Thermally Conductive Adhesive

    • Fluid
    • Hot polymerization
    • Good thermal conductivity values
    • No solvent added
    • Single-component - No need to mix separate components
    • Fast and versatile polymerization controlled by temperature
    • Fills and self-levels after dispensing
    • Heat dissipation from PCB systems to increase reliability
  • DOWSIL™ 3-1944 RTV Coating
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    DOWSIL™ 3-1944 RTV Coating

    • Single-component, does not require mixing
    • Good fluidity
    • After dispensing, it is capable of flowing, filling or self-leveling
    • Faster inline machining with optional thermal acceleration
    • No solvent added
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • UV indicator enables automatic inspection
  • DOWSIL™ 3-1953 Conformal Coating
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    DOWSIL™ 3-1953 Conformal Coating

    • No solvent added
    • Polymerization at room temperature
    • Slight thermal acceleration can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
  • DOWSIL™ 3-1965 Conformal Coating
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    DOWSIL™ 3-1965 Conformal Coating

    • No solvent added
    • Polymerization at room temperature
    • It can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Improves reliability against stresses
    • Promotes flow and filling of narrow spaces and crevices
  • DOWSIL™ 3-4150 Dielectric Gel Kit
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    DOWSIL™ 3-4150 Dielectric Gel Kit

    • Green when mixed
    • Rapid polymerization at room temperature
    • Reduces the risk of loading errors
  • DOWSIL™ 3-4207 Dielectric Tough Gel Kit
    Read more Quick View

    DOWSIL™ 3-4207 Dielectric Tough Gel Kit

    • When properly mixed, the gel is green
    • Conditional adhesion without primer at room temperature
    • Hardened gel for increased mechanical strength
    • UV indicator enables automatic inspection
    • Increased flame resistance
  • DOWSIL™ 3-4241 Dielectric Tough Gel Kit
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    DOWSIL™ 3-4241 Dielectric Tough Gel Kit

    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
  • DOWSIL™ 3-6371 UV Gel
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    DOWSIL™ 3-6371 UV Gel

    • UV curing in 1 part
    • Very soft
    • Suitable for very low temperatures
    • Does not require mixing
    • UV rays for fast processing speed
    • Polymerization secondary to moisture
    • The gel remains flexible even at very low temperatures
  • DOWSIL™ 3-6753 Thermally Conductive Adhesive
    Read more Quick View

    DOWSIL™ 3-6753 Thermally Conductive Adhesive

    • Mixing ratio: 1 to 1
    • Highly fluent
    • Self-leveling
    • Versatile thermal polymerization
    • Ensures heat flow away from components
    • With 7 mil glass microspheres
    • Check the thickness of the adhesion line
    • Without added solvents
  • DOWSIL™ 3140 RTV Coating
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    DOWSIL™ 3140 RTV Coating

    • Single-component
    • Does not require mixing
    • Good fluidity
    • Capable of flowing, filling or self-leveling
    • Polymerization at room temperature
    • No solvent added
    • UV indicator for manual and automatic inspections
  • DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
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    DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant

    • Mellow
    • High tensile strength and elongation resistance
    • High thermal stability
    • Single component - Does not require mixing
    • Polymerization at room temperature
  • DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
    Read more Quick View

    DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant

    • Mellow
    • Polymerization in rapid RTV
    • Good "green" resistance
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Fast skin time
    • High self-extinguishing
  • DOWSIL™ 340 Heat Sink Compound
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    DOWSIL™ 340 Heat Sink Compound

    • Not smooth
    • Moderate thermal conductivity
    • Does not require ovens or curing
    • Heat flow away from circuit components can increase reliability
  • DOWSIL™ 739 Plastic Adhesive
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    DOWSIL™ 739 Plastic Adhesive

    • Mellow
    • High elongation by stress reduction
    • Single-component - No mixing required
    • Polymerization at room temperature
    • High self-extinguishing
  • DOWSIL™ 744 RTV Adhesive Sealant
    Read more Quick View

    DOWSIL™ 744 RTV Adhesive Sealant

    • Cures at room temperature
    • Pasty consistency
    • It does not drip
    • Easy to apply
    • High elongation
    • Stable and flexible over a wide temperature range
  • DOWSIL™ 866 Primerless Silicone Adhesive
    Read more Quick View

    DOWSIL™ 866 Primerless Silicone Adhesive

    • Hot polymerization
    • High tensile strength
    • Single component - Does not require mixing
    • Fast and versatile curing with heat input fill or self-leveling after deployment
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