Dowsil electronics

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  • DOWSIL™ EG-1200 Gel
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    DOWSIL™ EG-1200 Gel
    • Gel is a two-component addition-cure silicone gel
    • Clear and flowable,
    • Designed for optically clear potting and coupling applications in displays and LED lighting systems.
    • High transparency
    • Reduced yellowing
    • High surface adhesion
    • Good stress absorption capacity
    • Provides mechanical protection, electrical insulation and long-term reliability.
    • Can cure at room temperature or with thermal acceleration.
  • DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
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    DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
    • Polymerization at room temperature
    • Low viscosity - ease of processing
    • Self-adhesive - no primer required
    • Reliable optical performance in difficult conditions
  • DOWSIL™ MS-1002 Moldable Silicone
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    DOWSIL™ MS-1002 Moldable Silicone
    • Two-component 1:1 optical silicone
    • Molding resin for optical applications
    • High light transmittance
    • Low chromatic dispersion
    • UV and heat resistant
    • High surface detail replication
    • High Shore A
    • Fast heat curing
  • DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
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    DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
    • Rapid polymerization
    • Suitable for very low temperatures
    • Rapid thermal polymerization to speed up processing
    • Gel remains flexible in ultra-low temperature applications
  • DOWSIL™ Q5-8401 Adhesive
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    DOWSIL™ Q5-8401 Adhesive
    • Two-component - Mixing ratio 1:1
    • Hot polymerization
    • High tensile strength
    • Good processing time after mixing
    • No solvent added
    • Fast and versatile polymerization controlled by temperature
    • Self-leveling
  • DOWSIL™ SC 102 Compound
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    DOWSIL™ SC 102 Compound
    • Moderate thermal conductivity
    • One part: no ovens or curing required
    • Pulls heat away from critical components
  • DOWSIL™ SE 1700 Adhesive
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    DOWSIL™ SE 1700 Adhesive
    • Mellow
    • Two-component - 10:1 mixing ratio
    • High tensile strength
    • Good processing time after mixing
    • Hot polymerization
  • DOWSIL™ SE 4486 Thermally Conductive Adhesive
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    DOWSIL™ SE 4486 Thermally Conductive Adhesive
    • One-component adhesive
    • Thermally conductive
    • Polymerizes with moisture
    • Fast drying to the touch
    • Good adhesion
    • Self-leveling
    • Controlled volatility (controlled migration of silanes)
  • DOWSIL™ SE 9120 S
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    DOWSIL™ SE 9120 S
    • Rapid polymerization in RT
    • Low viscosity
    • Controlled volatility of silicone
    • No solvent added
  • DOWSIL™ SE 9157 Conformal Coating
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    DOWSIL™ SE 9157 Conformal Coating
    • Rapid polymerization in RT, without notches
    • Medium viscosity
    • Polymerizes into a soft, low-stress elastomer
    • Without added solvents
    • Slight thermal acceleration can speed up in-line processing
    • Soft coating can improve reliability against stresses
  • DOWSIL™ SE 9184 RTV Adhesive
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    DOWSIL™ SE 9184 RTV Adhesive
    • Rapid polymerization in RT, without notches
    • Not smooth
    • Higher thermal conductivity
    • Controlled volatility of silicone
    • No mixing required
    • Polymerization at room temperature
    • Faster processing at room temperature
    • Used if increased flame resistance is required
  • DOWSIL™ SE 9185
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    DOWSIL™ SE 9185
    • Rapid polymerization in RT
    • Mellow
    • High elongation
    • Controlled volatility of silicone
    • Single-component - No mixing required
  • DOWSIL™ SE 9186 Sealant
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    DOWSIL™ SE 9186 Sealant
    • Volatility-controlled silicone
    • Polymerizes into a soft and elastic elastomer
    • No solvent added
    • Single-component - No mixing required
    • Polymerization at room temperature
  • DOWSIL™ SE 9187 L Adhesive
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    DOWSIL™ SE 9187 L Adhesive
    • Rapid polymerization
    • Very low viscosity
    • Controlled volatility of silicone
    • Solvent-free
    • Excellent smoothness, filling or self-leveling after distribution
    • Polymerizes into a soft, low-stress elastomer
    • Coating can improve reliability against stresses
  • DOWSIL™ SE 9188 RTV Adhesive
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    DOWSIL™ SE 9188 RTV Adhesive
    • Mellow
    • Controlled volatility of silicone
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Self-extinguishing UL94 V-0
  • DOWSIL™ SE 9189 L RTV
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    DOWSIL™ SE 9189 L RTV
    • Rapid polymerization
    • Sliding
    • Polymerizes into a soft, low-stress elastomer
    • Controlled volatility of silicone
    • No solvent added
    • Polymerization at room temperature
    • Faster processing at room temperature with thermal acceleration
    • Soft coating can improve reliability against stresses
    • Can be used if flame resistance required
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive
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    DOWSIL™ TC-2035 Thermally Conductive Adhesive
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4025 Dispensable Thermal Pad
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    DOWSIL™ TC-4025 Dispensable Thermal Pad
    • Can be used as a printable PAD
    • Can replace the traditional manufactured pad
    • Use as a gap filler
    • Dispensed or printed through manual or automated processes
    • Deposit of features for precise coverage of components
    • Lower cost of ownership than manufactured pads
    • Excellent thermal performance
    • Soft, stress-relieving and shock-dampening
    • Reworkable
  • DOWSIL™ TC-4515 Gap Filler A&B
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    DOWSIL™ TC-4515 Gap Filler A&B
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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    DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone