Showing 21–40 of 67 results

    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
    • One-part condensation cure silicone sealant
    • Space grade
    • Non-sag
    • Low controlled volatility
    • Cures at room temperature upon exposure to moisture
    • Does not require mixing
    • Designed for aerospace applications
    • Provides high elongation
    • Good physical and electrical stability
    • Complies with NASA low outgassing requirements
    • Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
    • Mellow
    • High elongation by stress reduction
    • Single-component - No mixing required
    • Polymerization at room temperature
    • High self-extinguishing
    • Cures at room temperature
    • Pasty consistency
    • It does not drip
    • Easy to apply
    • High elongation
    • Stable and flexible over a wide temperature range
    • Hot polymerization
    • High tensile strength
    • Single component - Does not require mixing
    • Fast and versatile curing with heat input fill or self-leveling after deployment
  • Good tensile strength High adhesive capacity Low thermal conductivity Good weather resistance Two-component with room temperature curing Stable even at high temperatures
    • Two-part silicone elastomer encapsulant
    • Low thermal vacuum outgassing
    • Physical and electrical stability
    • Wide operating temperature range.
    • Certified to NASA requirements for extreme environment applications.
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
    • One-component silicone conformal coating
    • Translucent
    • Low viscosity
    • Moisture cure (RTV)
    • Solvent-free
    • Provides environmental resistance
    • Dielectric protection
    • Long-term reliability even in harsh environmental conditions
    • UL recognized and includes a UV indicator for coating inspection.
    • Low viscosity
    • Good thermal conductivity
    • Mixing ratio 1 to 1
    • Polymerization at room temperature
    • Easy to mix and use
    • Good smoothness for fast processing and short cycle times
    • Promotes heat dissipation
    • Low ionic impurities
    • Very high thermal conductivity
    • Loaded silver
    • Good adhesion to Ni, Al, laminate and silicon
    • Microelectronic grade material
    • High electroconductive performance
    • Good adhesive performance for TIM1 applications
    • Two-part silicone adhesive
    • Non-sag
    • Fast low-temperature cure
    • Accelerated cure at moderate temperature (80 °C)
    • Rapid adhesion development.
    • The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
    • Maintains physical and electrical properties across a wide range of operating conditions.
    • Primerless adhesion
  • No mixing required No reaction exotherm during curing Excellent primerless adhesion on many substrates Excellent performance across a wide temperature range Cures into soft, low-stress elastomers Controlled volatility (controlled silane migration)
    • Electromagnetic shielding
    • Easy to dose and cure at room temperature
    • Dow's unique formulation enables adhesion to a variety of substrates
    • Durable mechanical and conductive properties, reliable performance
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
    • Reduces pressure on components
    • Effectively dissipates heat
    • Avoids delamination problems
    • The rapid polymerization
    • Optimized processing time
    • Allows for the implementation of complex projects
    • No additional dielectric barrier required
    • Allows for quick filling
    • It is suitable for high-throughput production processes.
    • Filling allows easy control of the process
    • Meets certification requirements