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DOWSIL™ 93-076 RF Aerospace Sealant
Good tensile strength High adhesive capacity Low thermal conductivity Good resistance to weathering Two-component with room temperature curing Stable even at high temperatures
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ DA-6534 Adhesive
Low ionic impurities
Very high thermal conductivity
Loaded silver
Good adhesion to Ni, Al, laminate and silicon
Microelectronic grade material
High electroconductive performance
Good adhesive performance for TIM1 applications
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DOWSIL™ EA-9189 H White RTV Adhesive
No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
Electromagnetic shielding
Easy to dose and cure at room temperature
Dow's unique formulation enables adhesion to a variety of substrates
Durable mechanical and conductive properties, reliable performance
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
Polymerization at room temperature
Low viscosity - ease of processing
Self-adhesive - no primer required
Reliable optical performance in difficult conditions
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
Rapid polymerization
Suitable for very low temperatures
Rapid thermal polymerization to speed up processing
Gel remains flexible in ultra-low temperature applications
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DOWSIL™ Q5-8401 Adhesive
Two-component - Mixing ratio 1:1
Hot polymerization
High tensile strength
Good processing time after mixing
No solvent added
Fast and versatile polymerization controlled by temperature
Self-leveling
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DOWSIL™ SC 102 Compound
Moderate thermal conductivity
One part: no ovens or curing required
Pulls heat away from critical components
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DOWSIL™ SE 1700 Adhesive
Mellow
Two-component - 10:1 mixing ratio
High tensile strength
Good processing time after mixing
Hot polymerization
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
One-component adhesive
Thermally conductive
Polymerizes with moisture
Fast drying to the touch
Good adhesion
Self-leveling
Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9120 S
Rapid polymerization in RT
Low viscosity
Controlled volatility of silicone
No solvent added
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DOWSIL™ SE 9157 Conformal Coating
Rapid polymerization in RT, without notches
Medium viscosity
Polymerizes into a soft, low-stress elastomer
Without added solvents
Slight thermal acceleration can speed up in-line processing
Soft coating can improve reliability against stresses
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DOWSIL™ SE 9184 RTV Adhesive
Rapid polymerization in RT, without notches
Not smooth
Higher thermal conductivity
Controlled volatility of silicone
No mixing required
Polymerization at room temperature
Faster processing at room temperature
Used if increased flame resistance is required
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DOWSIL™ SE 9185
Rapid polymerization in RT
Mellow
High elongation
Controlled volatility of silicone
Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
Volatility-controlled silicone
Polymerizes into a soft and elastic elastomer
No solvent added
Single-component - No mixing required
Polymerization at room temperature
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DOWSIL™ SE 9187 L Adhesive
Rapid polymerization
Very low viscosity
Controlled volatility of silicone
Solvent-free
Excellent smoothness, filling or self-leveling after distribution
Polymerizes into a soft, low-stress elastomer
Coating can improve reliability against stresses
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DOWSIL™ SE 9188 RTV Adhesive
Mellow
Controlled volatility of silicone
Single-component - No mixing required
Polymerization at room temperature
Self-extinguishing UL94 V-0
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DOWSIL™ SE 9189 L RTV
Rapid polymerization
Sliding
Polymerizes into a soft, low-stress elastomer
Controlled volatility of silicone
No solvent added
Polymerization at room temperature
Faster processing at room temperature with thermal acceleration
Soft coating can improve reliability against stresses
Can be used if flame resistance required
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