Showing 101–112 of 112 results
Filtri
Tipo di prodotto
- 1 Conductive paints
- 19 Conformal coating
- 5 Electrically conductive adhesives
- 16 Electronics adhesive
- 2 Gap filler
- 8 Gel
- 4 Greases
- 10 Heat-conductive adhesive
- 31 Resins and encapsulants
- 6 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Provides excellent EMI/RFI shielding over a wide frequency range
- Non-flammable and without harmful odors
- Shipping as non-DG by air
- Low VOC content
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- Provides excellent electromagnetic shielding
- Ideal for wood and drywall
- Ideal for musical instruments
- Non-flammable and without harmful odors
- Low VOC content
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- High electrical conductivity
- Creates strong permanent electrical connections
- No mixing is required
- Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
- Storage at room temperature (≤ 22 °C)
- Suitable for automated distribution
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- High thermal conductivity
- No mixing is required before use
- Provides strong electrical insulation
- Low curing temperature (<100 °C)
- Storage at room temperature (≤ 22 °C)
- Binds well to a wide variety of substances
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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- General use
- Low viscosity
- Addition curing system
- No polymerization by-products
- Self-healing gel
- Permanent pressure-sensitive adhesion
- Excellent dielectric properties
- Long-term sealing against atmospheric contaminants
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- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range
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- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
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- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability
