10 g

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    • Hardens in 5-10 minutes
    • Elongation > 200 %
    • Absorbs shock and vibration
    • High resistance to peeling
    • Bonding a wide range of materials including glass
    • Translucent, low efflorescence
    • Gel consistency for precise application
    • Non-drip for vertical applications
    • Fixing time in 60 seconds
    • Hardens in 5-10 minutes
    • Instant adhesion with high bond strength
    • Low volumetric contraction: 4.3 percent
    • Fills empty spaces of large volumes
    • Bonding a wide range of materials
    • Workable, sandable and paintable once cured
    • Impact resistant
    • The gel allows for precise application
    • Non-drip for vertical applications
    • Grip time 30 seconds
    • High adhesion strength: > 6 MPa after 5 min
    • Open time 25 minutes
    • Filling gaps between substrates up to 5 mm
    • Excellent adhesion to a wide variety of substrates
    • Translucent when cross-linked
    • Resistant to temperature and humidity
    • Gel consistency for precise dosing
    • Black, rigid two-part epoxy resin
    • PCB potting compound
    • Capable of filling small gaps and cavities
    • Mixing ratio 1:1 by volume
    • Low mixed viscosity of 4,100 cP
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
    • Solvent-free
    • Room temperature or heat-accelerated curing
    • One-part epoxy potting compound
    • Black and rigid
    • Ready to use, requires no mixing
    • Unlimited working life at room temperature
    • Heat cure from 80 °C
    • Low viscosity of 4,800 cP
    • Excellent chemical resistance
    • Excellent electrical insulation
    • High tensile and compressive strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Water and humidity resistant
    • Solvent-free