380 ml

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    • Black, rigid two-part epoxy resin
    • PCB potting compound
    • Capable of filling small gaps and cavities
    • Mixing ratio 1:1 by volume
    • Low mixed viscosity of 4,100 cP
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
    • Solvent-free
    • Room temperature or heat-accelerated curing