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Mostra Nascondi Filtri

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  • DOWSIL™ 1-4173 Thermally Conductive Adhesive
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    DOWSIL™ 1-4173 Thermally Conductive Adhesive
    • Fluid
    • Hot polymerization
    • Good thermal conductivity values
    • No solvent added
    • Single-component - No need to mix separate components
    • Fast and versatile polymerization controlled by temperature
    • Fills and self-levels after dispensing
    • Heat dissipation from PCB systems to increase reliability
  • DOWSIL™ 3-6265 HP Adhesive
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    DOWSIL™ 3-6265 HP Adhesive
    • Black one-component silicone adhesive
    • Thixotropic and non-sagging
    • Thermal addition cure polymerization
    • High tensile strength
    • Reduced void formation after curing, even on sensitive substrates
    • UL 94 V-0 rated
  • DOWSIL™ DA-6534 Adhesive
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    DOWSIL™ DA-6534 Adhesive
    • Low ionic impurities
    • Very high thermal conductivity
    • Loaded silver
    • Good adhesion to Ni, Al, laminate and silicon
    • Microelectronic grade material
    • High electroconductive performance
    • Good adhesive performance for TIM1 applications
  • DOWSIL™ EC-6601 Electrically Conductive Adhesive
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    DOWSIL™ EC-6601 Electrically Conductive Adhesive
    • Electromagnetic shielding
    • Easy to dose and cure at room temperature
    • Dow's unique formulation enables adhesion to a variety of substrates
    • Durable mechanical and conductive properties, reliable performance
  • DOWSIL™ Q5-8401 Adhesive
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    DOWSIL™ Q5-8401 Adhesive
    • Two-component - Mixing ratio 1:1
    • Hot polymerization
    • High tensile strength
    • Good processing time after mixing
    • No solvent added
    • Fast and versatile polymerization controlled by temperature
    • Self-leveling
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive
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    DOWSIL™ TC-2035 Thermally Conductive Adhesive
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
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    DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance