>30 / <60
Showing all 6 results
Filtri
Tipo di prodotto
- 6 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
