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Resins and encapsulants
Resins and encapsulants
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Silicone (6)
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
Two-component thermal conductive encapsulant
Suitable for PCB system
Protection in harsh environmental and thermal conditions
Can be used at room temperature
Used in the production of electrical products, PCBs and modules
Good adhesion to aluminum
Excellent dielectric properties
Good smoothness
Easy dispensing
Good flexibility for easy processing
Good adhesion without the use of primer
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SYLGARD™ 160 Silicone Elastomer Kit
Gray fluid encapsulant
Room temperature or hot curing
Fast and versatile curing process
Good dielectric properties
Moderate thermal conductivity
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SYLGARD™ 170 Silicone Elastomer Kit
Low viscosity
High open time
Moderate thermal conductivity
Polymerization at room temperature
Easy to apply
Stable and flexible over a wide temperature range
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SYLGARD™ 184 Silicone Elastomer Kit
Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
Mixing ratio 1 to 1
Sliding
Self-priming
No further priming is necessary
Fast and versatile polymerization controlled by temperature
Fluidity and filling in confined spaces and around complex geometries
Good dielectric properties
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