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Filtri

Tipo di prodotto
- 7 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
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- Excellent resistance to seawater
- High toughness and tear resistance
- Good adhesion to most substrates
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- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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- Durable and low viscosity
- Ideal for LED applications
- Mixing ratio 1:1 by volume
- Does not contain IPDI; low-risk material
- Suitable for a wide range of environments







