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    • Good resistance to thermal shock
    • Good dielectric properties
    • Good mechanical properties
    • Excellent thermal resistance
    • Thermally conductive epoxy
    • Easy to mix
    • Uses non-abrasive fillers
    • Flame retardant
    • Uses nonabrasive fillers
    • Used for encapsulation of PCBs.
    • Suitable for effective heat dissipation
    • Provides environmental protection
    • Improved thermal conductivity
    • Low viscosity for a loaded system
    • Contains no abrasive fillers
    • Low wear and tear on dosing machinery
    • Excellent resistance to seawater
    • High toughness and tear resistance
    • Good adhesion to most substrates
    • Durable, low-viscosity system
    • Ideal for encapsulation of LEDs
    • Mixing ratio 1:1 by volume
    • Promotes ease of processing
    • Does not contain IPDI; low-risk material
    • Resists water and mold growth
    • Durable and low viscosity
    • Ideal for LED applications
    • Mixing ratio 1:1 by volume
    • Does not contain IPDI; low-risk material
    • Suitable for a wide range of environments
    • Black, rigid two-part epoxy resin
    • PCB potting compound
    • Capable of filling small gaps and cavities
    • Mixing ratio 1:1 by volume
    • Low mixed viscosity of 4,100 cP
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
    • Solvent-free
    • Room temperature or heat-accelerated curing
    • Black two-component thermally conductive epoxy resin
    • Designed for applications where thermal management is a critical factor
    • Thermal conductivity of 0.68 W/(m·K)
    • Low exotherm
    • Mixing ratio 1:1 by volume
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics and numerous plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection from electrostatic discharge, vibration, abrasion, thermal shock, moisture, salt water, fungus and aggressive chemicals
    • Solvent-free
    • One-part epoxy potting compound
    • Black and rigid
    • Ready to use, requires no mixing
    • Unlimited working life at room temperature
    • Heat cure from 80 °C
    • Low viscosity of 4,800 cP
    • Excellent chemical resistance
    • Excellent electrical insulation
    • High tensile and compressive strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Water and humidity resistant
    • Solvent-free