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11
Resins and encapsulants
Resins and encapsulants
Marchio
Tecnologia
Tecnologia
Epoxy (1)
Polyurethane (1)
Silicone (9)
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
Polymerization at room temperature
Low viscosity - ease of processing
Self-adhesive - no primer required
Reliable optical performance in difficult conditions
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
Two-component thermal conductive encapsulant
Suitable for PCB system
Protection in harsh environmental and thermal conditions
Can be used at room temperature
Used in the production of electrical products, PCBs and modules
Good adhesion to aluminum
Excellent dielectric properties
Good smoothness
Easy dispensing
Good flexibility for easy processing
Good adhesion without the use of primer
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Electrolube ER2219 Epoxy Resin
One-component epoxy encapsulant
Semi-thixotropic
Effective polymerization quickly
High ionic purity
Low ionizable chlorine content
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Electrolube UR5118 Polyurethane Resin
Excellent electrical properties
Low dielectric constant
Excellent resistance to seawater
Very low viscosity
Rugged and tear-resistant
Low water absorption
Excellent resistance to oxidation
Excellent adhesion
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SYLGARD™ 160 Silicone Elastomer Kit
Gray fluid encapsulant
Room temperature or hot curing
Fast and versatile curing process
Good dielectric properties
Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
Fast and versatile polymerization, controlled by temperature
Good dielectric properties
Moderate thermal conductivity
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SYLGARD™ 170 Silicone Elastomer Kit
Low viscosity
High open time
Moderate thermal conductivity
Polymerization at room temperature
Easy to apply
Stable and flexible over a wide temperature range
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SYLGARD™ 184 Silicone Elastomer Kit
Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
Mixing ratio 1 to 1
Sliding
Self-priming
No further priming is necessary
Fast and versatile polymerization controlled by temperature
Fluidity and filling in confined spaces and around complex geometries
Good dielectric properties
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SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
Heat-conductive encapsulant
2 parts
Fluid, self-leveling
Long processing time at room temperature
Temperature-controlled polymerization
Increases reliability
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