Aerospace

Showing 1–20 of 48 results

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ARALDITE® 1570 FST A/B
- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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ARALDITE® 1641 A/B
- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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ARALDITE® 1644 A/B
- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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ARALDITE® 40002/40003
- Two-component epoxy system
- FST Properties (Fire, Smoke, Toxicity)
- Intrinsically flame retardant
- Low viscosity for infusion and RTM processes
- Heat curing
- High mechanical performance
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ARALDITE® 501 A/B
- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
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ARALDITE® LY 1564 SP / ARADUR® 2954
- Two-component epoxy system for composites
- Amine system without reactive diluents
- High flexibility and high reactivity
- Suitable for hot processes
- Good reinforcement impregnation
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ARALDITE® LY 3508 / ARADUR® 22962
- Toughened two-component epoxy system
- Medium resin viscosity
- Good toughness combined with low viscosity
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 3508 / ARADUR® 3475
- Two-component epoxy system
- Medium-viscosity toughened resin
- Good toughness and mechanical strength
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 5052 / ARADUR® 5052
- Two-component low-viscosity epoxy system
- Long pot life
- Good reinforcement impregnation
- Room temperature curing with post-cure capability
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ARALDITE® LY 8615 / ARADUR® 8615
- Two-component high-temperature epoxy system
- Low viscosity for RTM, SCRIMP, and VARTM processes
- Long pot life
- High glass transition temperature (Tg > 180 °C with post-cure)
- Suitable for the production of composite parts and molds
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CG 1305 A/B
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
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DOWSIL™ 1-4105 Conformal Coating
- Single-component silicone conformal coating
- Transparent
- Thermal polymerization
- Designed for the protection of rigid and flexible printed circuit boards.
- Low viscosity
- Without added solvents
- Cures into a soft, low-stress elastomer, reducing stress on electronic components.
- Incorporates a UV indicator to facilitate automated inspection
- UL, IPC and MIL certified.
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DOWSIL™ 3-6265 HP Adhesive
- Black one-component silicone adhesive
- Thixotropic and non-sagging
- Thermal addition cure polymerization
- High tensile strength
- Reduced void formation after curing, even on sensitive substrates
- UL 94 V-0 rated
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DOWSIL™ 3-6548 Silicone RTV Foam
- Two-component fire-resistant RTV silicone foam
- Two-component room temperature vulcanizing (RTV) silicone foam
- Fire resistant
- Good flexibility even under severe operating conditions
- Withstand high temperatures
- Designed to limit hazards such as smoke, flames and gases.
- Expands and cures at room temperature to form a closed-cell foam elastomer.
- Designed for creating fire-resistant seals in penetrations and linear joints.
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DOWSIL™ 6-1125 Controlled Volatility Sealant
- One-part condensation cure silicone sealant
- Space grade
- Non-sag
- Low controlled volatility
- Cures at room temperature upon exposure to moisture
- Does not require mixing
- Designed for aerospace applications
- Provides high elongation
- Good physical and electrical stability
- Complies with NASA low outgassing requirements
- Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
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DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
- Two-part silicone elastomer encapsulant
- Low thermal vacuum outgassing
- Physical and electrical stability
- Wide operating temperature range.
- Certified to NASA requirements for extreme environment applications.
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DOWSIL™ EA-6060 Adhesive
- Two-part silicone adhesive
- Non-sag
- Fast low-temperature cure
- Accelerated cure at moderate temperature (80 °C)
- Rapid adhesion development.
- The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
- Maintains physical and electrical properties across a wide range of operating conditions.
- Primerless adhesion
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DOWSIL™ MS-1002 Moldable Silicone
- Two-component 1:1 optical silicone
- Molding resin for optical applications
- High light transmittance
- Low chromatic dispersion
- UV and heat resistant
- High surface detail replication
- High Shore A
- Fast heat curing
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EPIBOND® 115 A/B
- High-temperature structural epoxy adhesive
- Two-component epoxy adhesive
- Service up to 149°C (300°F)
- High shear strength on metals and composites
- Thixotropic gap-filling paste
- Contains 125-micron spacer beads
- High Tg
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EPIBOND® 200 A/B
- Flexible epoxy structural adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Good performance retention after environmental aging
- 1:1 mixing ratio by weight and volume
- SVHC-free according to REACH