MgChemicals

Showing all 20 results

    • Thermal conductivity of 1.4 W/(m-K)
    • Mixing ratio 1:1
    • Processing time: 45 minutes
    • Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
    • Provides strong electrical insulation
    • High mechanical strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Thermal conductivity of 0.8 W/(m-K)
    • Mixing ratio 1:1
    • Fire retardant - UL 94V-0 registered
    • Processing time: 5 minutes
    • Laying time: 15 minutes
    • Provides strong electrical insulation
    • Low CTE before Tg
    • High tensile and compressive strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
    • Black, flexible two-part epoxy compound
    • Designed to reduce physical stress on components
    • Suitable for low-temperature environments and applications subject to thermal cycling or rapid temperature changes
    • Mixing ratio 1:1 by volume
    • Very low mixed viscosity of 700 cP
    • Good adhesion to metals, composites, glass, ceramics, and many plastics
    • Excellent electrical insulation properties
    • High resistance to water and moisture, even when submerged
    • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
    • Solvent-free
    • Black, rigid two-part epoxy resin
    • PCB potting compound
    • Capable of filling small gaps and cavities
    • Mixing ratio 1:1 by volume
    • Low mixed viscosity of 4,100 cP
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
    • Solvent-free
    • Room temperature or heat-accelerated curing
    • Black two-component thermally conductive epoxy resin
    • Designed for applications where thermal management is a critical factor
    • Thermal conductivity of 0.68 W/(m·K)
    • Low exotherm
    • Mixing ratio 1:1 by volume
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics and numerous plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection from electrostatic discharge, vibration, abrasion, thermal shock, moisture, salt water, fungus and aggressive chemicals
    • Solvent-free
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substratesStorage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Provides >52 dB RFI shielding at frequencies <1 MHz
    • Excellent adhesion to plastics
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene or xylene
    • UL Recognized (File No. E202609)
    • Provides effective EMI/RFI shielding over a wide range of frequencies
    • Strong corrosion resistance
    • Gentle and safe solvent system on polystyrenes
    • HAP free-does not contain toluene, xylene, or MEK
    • Available in aerosol format
    • Good conductivity
    • Provides good RFI shielding
    • Extreme durability and grip
    • Strong resistance to solvents
    • Excellent corrosion and salt spray resistance
    • Provides effective EMF shielding
    • Ideal for wood and drywall
    • Ideal for shielding the cavities of electric guitars
    • Non-flammable and without harmful odors
    • Low VOC content
    • Provides superior EMI shielding
    • Excellent adhesion to plastics
    • Minimum height of thin layer
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene, xylene or MEK
    • Upper EMI shielding
    • Polymerization at room temperature and high
    • Excellent chemical and corrosion resistance
    • Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
    • Resists wave soldering
    • Without MEK and HAPS
    • Provides excellent EMI/RFI shielding over a wide frequency range
    • Non-flammable and without harmful odors
    • Shipping as non-DG by air
    • Low VOC content
    • Provides excellent electromagnetic shielding
    • Ideal for wood and drywall
    • Ideal for musical instruments
    • Non-flammable and without harmful odors
    • Low VOC content
    • High electrical conductivity
    • Creates strong permanent electrical connections
    • No mixing is required
    • Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
    • Storage at room temperature (≤ 22 °C)
    • Suitable for automated distribution
    • High thermal conductivity
    • No mixing is required before use
    • Provides strong electrical insulation
    • Low curing temperature (<100 °C)
    • Storage at room temperature (≤ 22 °C)
    • Binds well to a wide variety of substances
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • One-part epoxy potting compound
    • Black and rigid
    • Ready to use, requires no mixing
    • Unlimited working life at room temperature
    • Heat cure from 80 °C
    • Low viscosity of 4,800 cP
    • Excellent chemical resistance
    • Excellent electrical insulation
    • High tensile and compressive strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Water and humidity resistant
    • Solvent-free