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Heat-conductive adhesive

Showing 1–20 of 26 results

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1 Conductive paints Conductive paints
5 Electrically conductive adhesives Electrically conductive adhesives
10 Heat-conductive adhesive Heat-conductive adhesive

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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 340 Heat Sink Compound
- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
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DOWSIL™ EA-9189 H White RTV Adhesive

No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-5080 Thermally Conductive Compound
- Good thermal conductivity
- Low oil bleed
- Stable at high temperatures
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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MG Chemicals 8329TCM
- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8329TFF
- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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MG Chemicals 8330D
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substratesStorage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8330S
- Low outgassing approved by NASA
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331D
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331S
- Low outgassing approved by NASA
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 838AR
- Provides >52 dB RFI shielding at frequencies <1 MHz
- Excellent adhesion to plastics
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene or xylene
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MG Chemicals 841AR
- UL Recognized (File No. E202609)
- Provides effective EMI/RFI shielding over a wide range of frequencies
- Strong corrosion resistance
- Gentle and safe solvent system on polystyrenes
- HAP free-does not contain toluene, xylene, or MEK
- Available in aerosol format
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MG Chemicals 841ER
- Good conductivity
- Provides good RFI shielding
- Extreme durability and grip
- Strong resistance to solvents
- Excellent corrosion and salt spray resistance
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MG Chemicals 841WB
- Provides effective EMF shielding
- Ideal for wood and drywall
- Ideal for shielding the cavities of electric guitars
- Non-flammable and without harmful odors
- Low VOC content

Heat-conductive adhesive

Filtri

Product type

Brands

Technology

Applications

DOWSIL™ 3-6753 Thermally Conductive Adhesive

DOWSIL™ 340 Heat Sink Compound

DOWSIL™ EA-9189 H White RTV Adhesive

DOWSIL™ SE 4486 Thermally Conductive Adhesive

DOWSIL™ SE 9184 RTV Adhesive

DOWSIL™ TC-4025 Dispensable Thermal Pad

DOWSIL™ TC-5026 Thermally Conductive Compound

DOWSIL™ TC-5080 Thermally Conductive Compound

DOWSIL™ TC-5121C LV Thermally Conductive Compound

DOWSIL™ TC-5622 Thermally Conductive Compound

MG Chemicals 8329TCM

MG Chemicals 8329TFF

MG Chemicals 8330D

MG Chemicals 8330S

MG Chemicals 8331D

MG Chemicals 8331S

MG Chemicals 838AR

MG Chemicals 841AR

MG Chemicals 841ER

MG Chemicals 841WB

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