Heat-conductive adhesive

Showing 1–20 of 26 results

Tipo di prodotto

1 Conductive paints Conductive paints
5 Electrically conductive adhesives Electrically conductive adhesives
10 Heat-conductive adhesive Heat-conductive adhesive

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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 340 Heat Sink Compound
- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
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DOWSIL™ EA-9189 H White RTV Adhesive

No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-5080 Thermally Conductive Compound
- Good thermal conductivity
- Low oil bleed
- Stable at high temperatures
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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MG Chemicals 8329TCM
- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8329TFF
- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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MG Chemicals 8330D
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substratesStorage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8330S
- Low outgassing approved by NASA
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331D
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331S
- Low outgassing approved by NASA
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 838AR
- Provides >52 dB RFI shielding at frequencies <1 MHz
- Excellent adhesion to plastics
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene or xylene
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MG Chemicals 841AR
- UL Recognized (File No. E202609)
- Provides effective EMI/RFI shielding over a wide range of frequencies
- Strong corrosion resistance
- Gentle and safe solvent system on polystyrenes
- HAP free-does not contain toluene, xylene, or MEK
- Available in aerosol format
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MG Chemicals 841ER
- Good conductivity
- Provides good RFI shielding
- Extreme durability and grip
- Strong resistance to solvents
- Excellent corrosion and salt spray resistance
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MG Chemicals 841WB
- Provides effective EMF shielding
- Ideal for wood and drywall
- Ideal for shielding the cavities of electric guitars
- Non-flammable and without harmful odors
- Low VOC content