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Silicone
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Silicone (51)
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DOWSIL™ 1-2577 Conformal Coating
Cures to an elastoplastic surface
Resilient and abrasion resistant
Single-component solvent-based resin coating
Polymerization at room temperature
It can speed up in-line processing
UV indicator enables automatic inspection
Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
Cures to an elastoplastic surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
The optional thermal acceleration (after solvent wilting)
UV indicator enables automated inspection
Allows use with many low-solids lead-free solder
Reduced VOC content
Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
Cures to a robust surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
Possibility of acceleration after solvent spillage
UV indicator for inspection
Allows use with many low-solids lead-free solder
Low viscosity improves flow and
fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
Medium viscosity
Low VOC content
Abrasion resistance
Good dielectric properties
Good adhesion to many substrates
Polymerization at room temperature
Stable and flexible over a wide temperature range
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DOWSIL™ 3-1944 RTV Coating
Single-component, does not require mixing
Good fluidity
After dispensing, it is capable of flowing, filling or self-leveling
Faster inline machining with optional thermal acceleration
No solvent added
Allows use with many low-solids lead-free solder
Soft coating improves reliability against stresses
UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
No solvent added
Polymerization at room temperature
Slight thermal acceleration can speed up in-line processing
Good adhesion to many substrates
Allows use with many low-solids lead-free solder
Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
No solvent added
Polymerization at room temperature
It can speed up in-line processing
Good adhesion to many substrates
Allows use with many low-solids lead-free solder
Improves reliability against stresses
Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3-4150 Dielectric Gel Kit
Green when mixed
Rapid polymerization at room temperature
Reduces the risk of loading errors
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
When properly mixed, the gel is green
Conditional adhesion without primer at room temperature
Hardened gel for increased mechanical strength
UV indicator enables automatic inspection
Increased flame resistance
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
Slow-curing two-component silicone dielectric gel
Good flame resistance
Good mechanical strength
Contains UV indicator for inspection
Adhesion without the use of primer
Cures extremely softly
Designed to insulate circuits from the damaging effects of moisture
Provides electrical insulation for high voltages
Protects circuits and interconnections from thermal stresses
Low viscosity
Odorless
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DOWSIL™ 3-6371 UV Gel
UV curing in 1 part
Very soft
Suitable for very low temperatures
Does not require mixing
UV rays for fast processing speed
Polymerization secondary to moisture
The gel remains flexible even at very low temperatures
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
Polymerization at room temperature
Low viscosity - ease of processing
Self-adhesive - no primer required
Reliable optical performance in difficult conditions
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
Rapid polymerization
Suitable for very low temperatures
Rapid thermal polymerization to speed up processing
Gel remains flexible in ultra-low temperature applications
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DOWSIL™ SE 9157 Conformal Coating
Rapid polymerization in RT, without notches
Medium viscosity
Polymerizes into a soft, low-stress elastomer
Without added solvents
Slight thermal acceleration can speed up in-line processing
Soft coating can improve reliability against stresses
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DOWSIL™ SE 9187 L Adhesive
Rapid polymerization
Very low viscosity
Controlled volatility of silicone
Solvent-free
Excellent smoothness, filling or self-leveling after distribution
Polymerizes into a soft, low-stress elastomer
Coating can improve reliability against stresses
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DOWSIL™ SE 9189 L RTV
Rapid polymerization
Sliding
Polymerizes into a soft, low-stress elastomer
Controlled volatility of silicone
No solvent added
Polymerization at room temperature
Faster processing at room temperature with thermal acceleration
Soft coating can improve reliability against stresses
Can be used if flame resistance required
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
Two-component thermal conductive encapsulant
Suitable for PCB system
Protection in harsh environmental and thermal conditions
Can be used at room temperature
Used in the production of electrical products, PCBs and modules
Good adhesion to aluminum
Excellent dielectric properties
Good smoothness
Easy dispensing
Good flexibility for easy processing
Good adhesion without the use of primer
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Electrolube FSC Flexible Silicone Coating
High resistance to surface insulation
Good resistance to wet environments
Flexible coating
Good resistance to a wide and variable temperature range
Ideal for applications requiring rework
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