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Filtri

Tipo di prodotto
- 1 Gel
- 10 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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- General purpose epoxy resin
- Economic solution
- Good chemical and water resistance
- Excellent adhesion to a wide variety of substrates
- Excellent electrical properties
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- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
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- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available











