Gap filler

Mostra Nascondi Filtri

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

  • DOWSIL™ 4535
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    DOWSIL™ 4535
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
  • DOWSIL™ 5515
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    DOWSIL™ 5515
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
  • DOWSIL™ TC-4515 Gap Filler A&B
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    DOWSIL™ TC-4515 Gap Filler A&B
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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    DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone