>1,000 / <3,000 mPa.s

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16 Resins and encapsulants Resins and encapsulants

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Technology

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Araldite® DBF
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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Electrolube ER2219 Epoxy Resin
- One-component epoxy encapsulant
- Semi-thixotropic
- Effective polymerization quickly
- High ionic purity
- Low ionizable chlorine content
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Electrolube UR5041 Polyurethane Resin
- Excellent resistance to seawater
- High toughness and tear resistance
- Good adhesion to most substrates
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Electrolube UR5118 Polyurethane Resin
- Excellent electrical properties
- Low dielectric constant
- Excellent resistance to seawater
- Very low viscosity
- Rugged and tear-resistant
- Low water absorption
- Excellent resistance to oxidation
- Excellent adhesion
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Electrolube UR5528 Polyurethane Resin
- High degree of toughness
- Adhesion to a wide variety of substrates
- Easy application
- Perfect where moisture ingress is a problem
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Electrolube UR5608 Polyurethane Resin
- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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Electrolube UR5634 Polyurethane Resin
- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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Electrolube UR5635 Polyurethane Resin
- Durable and low viscosity
- Ideal for LED applications
- Mixing ratio 1:1 by volume
- Does not contain IPDI; low-risk material
- Suitable for a wide range of environments
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SYLGARD™ 170 Silicone Elastomer Kit
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties