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>3,000 / <6,000 mPa.s
>3,000 / <6,000 mPa.s
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Viscosity
>3,000 / <6,000 mPa.s
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Resins and encapsulants
Resins and encapsulants
Brands
Technology
Technology
Epoxy (3)
Polyurethane (1)
Silicone (3)
Applications
Applications
Applications
Amplifiers (2)
Connectors (2)
E-Mobility (1)
Electronic Components (2)
Inverter (1)
LED Luminaires (2)
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Relay (2)
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Araldite® CY 221 / Aradur® HY 2966
Good heat resistance
Resistant to atmospheric and chemical degradation
Good crack resistance
Excellent castability and impregnation
Mixing ratio 100:25 by weight
Elastic thermal shock absorberepentine system
Suitable for low-stress encapsulants
Excellent electrical properties
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Electrolube ER2183 Epoxy Resin
Thermally conductive epoxy
Easy to mix
Uses non-abrasive fillers
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Electrolube ER2221 Epoxy Resin
Improved thermal conductivity
Low viscosity for a loaded system
Contains no abrasive fillers
Low wear and tear on dosing machinery
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Electrolube UR5044 Polyurethane Resin
Soft, reworkable resin
It can be "dug out"
Flexible even in extreme temperatures
Ideal for prototype circuits
Replacement of silicone and control unit
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SYLGARD™ 160 Silicone Elastomer Kit
Gray fluid encapsulant
Room temperature or hot curing
Fast and versatile curing process
Good dielectric properties
Moderate thermal conductivity
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SYLGARD™ 184 Silicone Elastomer Kit
Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
Heat-conductive encapsulant
2 parts
Fluid, self-leveling
Long processing time at room temperature
Temperature-controlled polymerization
Increases reliability
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