>3,000 / <6,000 mPa.s
Showing all 7 results
Filtri
Tipo di prodotto
- 7 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
-
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
-
- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
-
- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
-
- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
-
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
-
Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
-
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability
