>3,000 / <6,000 mPa.s

Mostra Nascondi Filtri

Showing all 10 results

  • Araldite® CY 221 / Aradur® HY 2966
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    Araldite® CY 221 / Aradur® HY 2966
    • Good heat resistance
    • Resistant to atmospheric and chemical degradation
    • Good crack resistance
    • Excellent castability and impregnation
    • Mixing ratio 100:25 by weight
    • Elastic thermal shock absorberepentine system
    • Suitable for low-stress encapsulants
    • Excellent electrical properties
  • Electrolube ER2183 Epoxy Resin
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    Electrolube ER2183 Epoxy Resin
    • Thermally conductive epoxy
    • Easy to mix
    • Uses non-abrasive fillers
  • Electrolube ER2221 Epoxy Resin
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    Electrolube ER2221 Epoxy Resin
    • Improved thermal conductivity
    • Low viscosity for a loaded system
    • Contains no abrasive fillers
    • Low wear and tear on dosing machinery
  • Electrolube UR5044 Polyurethane Resin
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    Electrolube UR5044 Polyurethane Resin
    • Soft, reworkable resin
    • It can be "dug out"
    • Flexible even in extreme temperatures
    • Ideal for prototype circuits
    • Replacement of silicone and control unit
  • MG Chemicals 832HD
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    MG Chemicals 832HD
    • Black, rigid two-part epoxy resin
    • PCB potting compound
    • Capable of filling small gaps and cavities
    • Mixing ratio 1:1 by volume
    • Low mixed viscosity of 4,100 cP
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
    • Solvent-free
    • Room temperature or heat-accelerated curing
  • MG Chemicals 9510 One-Part Epoxy Potting Compound
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    MG Chemicals 9510 One-Part Epoxy Potting Compound
    • One-part epoxy potting compound
    • Black and rigid
    • Ready to use, requires no mixing
    • Unlimited working life at room temperature
    • Heat cure from 80 °C
    • Low viscosity of 4,800 cP
    • Excellent chemical resistance
    • Excellent electrical insulation
    • High tensile and compressive strength
    • Excellent adhesion to metals, composites, glass, ceramics, and many plastics
    • Water and humidity resistant
    • Solvent-free
  • SILASTIC™ RTV-4230-E Base and Curing Agent
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    SILASTIC™ RTV-4230-E Base and Curing Agent
    • Two-component addition-cure RTV silicone
    • High mechanical strength
    • High tear resistance
    • High elongation
    • Minimal shrinkage (0–0.1%)
    • Long pot life
    • Cures at room temperature in 24 hours
    • Heat-accelerated cure
    • Acceptable for food contact
  • SYLGARD™ 160 Silicone Elastomer Kit
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    SYLGARD™ 160 Silicone Elastomer Kit
    • Gray fluid encapsulant
    • Room temperature or hot curing
    • Fast and versatile curing process
    • Good dielectric properties
    • Moderate thermal conductivity
  • SYLGARD™ 184 Silicone Elastomer Kit
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    SYLGARD™ 184 Silicone Elastomer Kit
    Medium viscosity Long open time Good dielectric properties High transparency Room temperature cure Heat-accelerable Stable and flexible over a wide temperature range Good flame resistance
  • SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
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    SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
    • Heat-conductive encapsulant
    • 2 parts
    • Fluid, self-leveling
    • Long processing time at room temperature
    • Temperature-controlled polymerization
    • Increases reliability