Part A: 190 mPa·s

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Two-part silicone adhesive
    • Non-sag
    • Fast low-temperature cure
    • Accelerated cure at moderate temperature (80 °C)
    • Rapid adhesion development.
    • The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
    • Maintains physical and electrical properties across a wide range of operating conditions.
    • Primerless adhesion