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🧭 Where you are: mascherpa.it » Blog » DOW solutions for 5G networks: telecommunications, data centers and consumer devices

Dow launches interactive platform to connect the world with its end-to-end silicon solutions for 5G networks

Dow has announced the launch of
5G.dow.com
, a guided selection tool that enables customers to find silicone adhesives and sealants solutions specific to 5G-enabled technology.

The interactive platform is a tool to connect current and potential customers with Dow’s 5G ecosystem, with Dow’s growing portfolio of solutions helping to enable smart connectivity and the future of communications.

5G, or fifth-generation technology, is a massive evolution in telecommunications, enabling unprecedented levels of intelligent connectivity with significant improvements in quality of service, delay, throughput,energy efficiency and system performance.

With product innovations and proven materials, Dow’s 5G ecosystem helps advance this technology with Dow’s product options for thermal management, electromagnetic interference (EMI) shielding, adhesion, sealing and encapsulation, and component molding.

Dow’s high-performance silicone solutions help promote both innovation and sustainability goals by offering materials with thermal protection properties , low volatile emissions, solvent-free formulations, and room-temperature curing to save energy.

“5G.dow.com is one of many such tools Dow is implementing globally to help provide a more personalized, step-by-step journey for our customers and make it easier for them to find the most relevant information on Dow.com.”, said Cathy Chu, strategic marketing director of Dow Consumer Solutions. “This platform can play a significant role in enabling next-generation technologies and the future of faster, smarter and easier connectivity. We are excited to make this incredible resource available.”

The future of connectivity begins on 5G.dow.com

Visitors accessing
5G.dow.com
will start at the“splash page,” which includes a brief introduction and invitation to begin the 5G ecosystem landing page, where they can explore a broad application area or click on specific sub-applications.

Throughout the site, 3D videos show where Dow silicone technology can be found in various technologies, such as:

  • 5G-enabled consumer devices and technologies(smartphones, PCs, wearable devices, and advanced driver assistance systems (ADAS) ;
  • Telecommunications infrastructure (base stations, optical communications, core networks);
  • cloud computing and data centers (servers, high-performance computing chips and other data communication devices and equipment).

End-to-end product solutions for the 5G ecosystem

“Dow offers one of the world’s largest and most robust portfolios of silicones and silicone-based solutions for the 5G ecosystem.”, said Chang Lee, Global R&D Director, Dow Consumer Solutions. “Silicones are truly remarkable, high-performance materials with properties that can be fine-tuned to meet the specific needs of customers. They can also help producers speed up production, reduce energy consumption and promote sustainability. With 5G.dow.com, we are making our silicone and silicone-based solutions more accessible than ever to those seeking them for their applications.”


5G.dow.com
offers an easy and intuitive way to connect to Dow’s innovative end-to-end silicon solutions in the following areas:

Thermal management

For the thermal management of 5G-enabled smart devices, 5G base stations, cloud computing, and data centers, Dow provides thermal-conductive silicone greases, gels, adhesives, and encapsulants that drive harmful heat away from electronic components.

EMI Shielding

To protect sensitive electronic devices from electromagnetic interference that can cause malfunctions, data loss, or even failure, Dow provides adhesives, elastomers, coatings, emulsions, and site-formed gaskets (FIPGs) made of electrically conductive silicone that block EMI.

Adhesion, sealing and encapsulation

Dow’s silicone adhesives, sealants, conformal coatings, and encapsulants enable delicate electronic components to perform consistently, even under environmental conditions