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MG Chemicals

Shielding, protection and bonding for electronic products.

MG Chemicals: electrically conductive paints, electrically and thermally conductive adhesives

MG Chemicals has been providing advanced solutions for electronics for more than 60 years, specializing in high-efficiency conductive paints and adhesives. The products provide EMI/RFI shielding and ESD protection, ensure strong electrical connections, and are ideal for circuit repairs and sensitive component fastenings. In addition, the available adhesive ranges facilitate bonding and thermal management in complex applications without the need for mechanical fasteners.

Conductive paints

  • Conductive paints combine a non-conductive resin binder and an electrically active pigment to offer advanced solutions in EMI/RFI shielding and ESD protection. Formulated with fillers such as branched carbon powder, nickel flakes, silver-plated copper, and silver, they ensure optimal performance for various frequencies and corrosion resistance.
  • Available binders such as solvent-acyclic, water-based, epoxy and urethane ensure adhesion, durability and versatile applicability. The properties of conductive coatings are useful for grounding, prototyping, and galvanic corrosion protection.

Electrically conductive adhesives

Conductive adhesives ensure strong electrical connections on surfaces where soldering is not possible. They offer excellent electrical and thermal conductivity, high chemical resistance and mechanical stability, making them ideal for circuit repairs and bonding of sensitive components. These adhesives are available in different formulations and are suitable for many applications such as, for example, bonding LEDs and components to PCBs.

Thermally conductive adhesives

MG Chemicals’ thermally conductive epoxy adhesives are designed to provide effective and durable bonding a bonding of heat-generating electronic components, such as heat sinks, LEDs, and power modules. Available in single-component versions, which require no mixing, and two-component versions with a 1:1 mixing ratio, these adhesives provide excellent thermal conductivity and electrical insulation, adapting to a variety of processing needs.

One-component epoxy adhesives

Single-component epoxy adhesives simplify production with easy application without mixing and unlimited processing time. With low- to moderate-temperature curing and long shelf life, they offer excellent adhesion to various substrates, ideal for SMT assembly, chip bonding, LED manufacturing and telecommunication devices.

Products

    • Provides excellent electromagnetic shielding
    • Ideal for wood and drywall
    • Ideal for musical instruments
    • Non-flammable and without harmful odors
    • Low VOC content
    • Provides excellent EMI/RFI shielding over a wide frequency range
    • Non-flammable and without harmful odors
    • Shipping as non-DG by air
    • Low VOC content
    • Provides effective EMF shielding
    • Ideal for wood and drywall
    • Ideal for shielding the cavities of electric guitars
    • Non-flammable and without harmful odors
    • Low VOC content
    • Upper EMI shielding
    • Polymerization at room temperature and high
    • Excellent chemical and corrosion resistance
    • Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
    • Resists wave soldering
    • Without MEK and HAPS
    • Good conductivity
    • Provides good RFI shielding
    • Extreme durability and grip
    • Strong resistance to solvents
    • Excellent corrosion and salt spray resistance
    • Provides superior EMI shielding
    • Excellent adhesion to plastics
    • Minimum height of thin layer
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene, xylene or MEK
    • UL Recognized (File No. E202609)
    • Provides effective EMI/RFI shielding over a wide range of frequencies
    • Strong corrosion resistance
    • Gentle and safe solvent system on polystyrenes
    • HAP free-does not contain toluene, xylene, or MEK
    • Available in aerosol format
    • Provides >52 dB RFI shielding at frequencies <1 MHz
    • Excellent adhesion to plastics
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene or xylene
    • Low outgassing approved by NASA
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substratesStorage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • High electrical conductivity
    • Creates strong permanent electrical connections
    • No mixing is required
    • Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
    • Storage at room temperature (≤ 22 °C)
    • Suitable for automated distribution
    • Thermal conductivity of 1.4 W/(m-K)
    • Mixing ratio 1:1
    • Processing time: 45 minutes
    • Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
    • Provides strong electrical insulation
    • High mechanical strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Thermal conductivity of 0.8 W/(m-K)
    • Mixing ratio 1:1
    • Fire retardant - UL 94V-0 registered
    • Processing time: 5 minutes
    • Laying time: 15 minutes
    • Provides strong electrical insulation
    • Low CTE before Tg
    • High tensile and compressive strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
    • High thermal conductivity
    • No mixing is required before use
    • Provides strong electrical insulation
    • Low curing temperature (<100 °C)
    • Storage at room temperature (≤ 22 °C)
    • Binds well to a wide variety of substances
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons

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