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Printed circuit board PCB
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DOWSIL™ 1-2577 Conformal Coating
Cures to an elastoplastic surface
Resilient and abrasion resistant
Single-component solvent-based resin coating
Polymerization at room temperature
It can speed up in-line processing
UV indicator enables automatic inspection
Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
Cures to a robust surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
Possibility of acceleration after solvent spillage
UV indicator for inspection
Allows use with many low-solids lead-free solder
Low viscosity improves flow and
fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
Medium viscosity
Low VOC content
Abrasion resistance
Good dielectric properties
Good adhesion to many substrates
Polymerization at room temperature
Stable and flexible over a wide temperature range
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
Fluid
Hot polymerization
Good thermal conductivity values
No solvent added
Single-component - No need to mix separate components
Fast and versatile polymerization controlled by temperature
Fills and self-levels after dispensing
Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3-1944 RTV Coating
Single-component, does not require mixing
Good fluidity
After dispensing, it is capable of flowing, filling or self-leveling
Faster inline machining with optional thermal acceleration
No solvent added
Allows use with many low-solids lead-free solder
Soft coating improves reliability against stresses
UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
No solvent added
Polymerization at room temperature
Slight thermal acceleration can speed up in-line processing
Good adhesion to many substrates
Allows use with many low-solids lead-free solder
Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
No solvent added
Polymerization at room temperature
It can speed up in-line processing
Good adhesion to many substrates
Allows use with many low-solids lead-free solder
Improves reliability against stresses
Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
When properly mixed, the gel is green
Conditional adhesion without primer at room temperature
Hardened gel for increased mechanical strength
UV indicator enables automatic inspection
Increased flame resistance
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
Mixing ratio: 1 to 1
Highly fluent
Self-leveling
Versatile thermal polymerization
Ensures heat flow away from components
With 7 mil glass microspheres
Check the thickness of the adhesion line
Without added solvents
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DOWSIL™ 3140 RTV Coating
Single-component
Does not require mixing
Good fluidity
Capable of flowing, filling or self-leveling
Polymerization at room temperature
No solvent added
UV indicator for manual and automatic inspections
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
Mellow
High tensile strength and elongation resistance
High thermal stability
Single component - Does not require mixing
Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
Mellow
Polymerization in rapid RTV
Good "green" resistance
Single-component - No mixing required
Polymerization at room temperature
Fast skin time
High self-extinguishing
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DOWSIL™ 739 Plastic Adhesive
Mellow
High elongation by stress reduction
Single-component - No mixing required
Polymerization at room temperature
High self-extinguishing
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DOWSIL™ 744 RTV Adhesive Sealant
Cures at room temperature
Pasty consistency
It does not drip
Easy to apply
High elongation
Stable and flexible over a wide temperature range
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DOWSIL™ EA-9189 H White RTV Adhesive
No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
Polymerization at room temperature
Low viscosity - ease of processing
Self-adhesive - no primer required
Reliable optical performance in difficult conditions
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
Rapid polymerization
Suitable for very low temperatures
Rapid thermal polymerization to speed up processing
Gel remains flexible in ultra-low temperature applications
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DOWSIL™ SE 1700 Adhesive
Mellow
Two-component - 10:1 mixing ratio
High tensile strength
Good processing time after mixing
Hot polymerization
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DOWSIL™ SE 9120 S
Rapid polymerization in RT
Low viscosity
Controlled volatility of silicone
No solvent added
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