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V-0

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Product type

11 Conformal coating Conformal coating
3 Electronics adhesive Electronics adhesive
2 Gap filler Gap filler
2 Heat-conductive adhesive Heat-conductive adhesive
21 Resins and encapsulants Resins and encapsulants
1 Thermal conductive paste Thermal conductive paste

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Applications

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SYLGARD™ 170 Silicone Elastomer Kit
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties

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