V-0

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Low viscosity
    • Flexible jets
    • Good resistance to thermal shock
    • Semi-rigid system
    • Good resistance to temperature shock
    • Flexible jets
    • Low viscosity
    • Good resistance to thermal shock
    • Good dielectric properties
    • Good mechanical properties
    • Excellent thermal resistance
    • Good thermal resistance
    • Excellent sliding properties
    • Good thermal conductivity
    • Non-abrasive casting system
    • Good resistance to thermal shock
    • Two-component resin for high temperature
    • It cross-links at room temperature but can be accelerated with heat
    • Halogen-free system
    • Polymerization at room temperature or moderate heat
    • Easy castability and impregnation
    • Mixing ratio 100:23 by weight
    • Excellent electrical properties
    • Absorbs sudden thermal shock
    • Suitable for a low-stress encapsulant
    • Halogen free
    • Cures to an elastoplastic surface
    • Resilient and abrasion resistant
    • Single-component solvent-based resin coating
    • Polymerization at room temperature
    • It can speed up in-line processing
    • UV indicator enables automatic inspection
    • Allows use with many low-solids lead-free solder
    • Cures to an elastoplastic surface
    • Resilient and abrasion resistant
    • Solvent-based resin coating
    • Polymerization at room temperature
    • The optional thermal acceleration (after solvent wilting)
    • UV indicator enables automated inspection
    • Allows use with many low-solids lead-free solder
    • Reduced VOC content
    • Emission recovery can be simplified for VOCs in some U.S. states
    • Cures to a robust surface
    • Resilient and abrasion resistant
    • Solvent-based resin coating
    • Polymerization at room temperature
    • Possibility of acceleration after solvent spillage
    • UV indicator for inspection
    • Allows use with many low-solids lead-free solder
    • Low viscosity improves flow and
    • fill tight spaces and gaps
    • Medium viscosity
    • Low VOC content
    • Abrasion resistance
    • Good dielectric properties
    • Good adhesion to many substrates
    • Polymerization at room temperature
    • Stable and flexible over a wide temperature range
    • Fluid
    • Hot polymerization
    • Good thermal conductivity values
    • No solvent added
    • Single-component - No need to mix separate components
    • Fast and versatile polymerization controlled by temperature
    • Fills and self-levels after dispensing
    • Heat dissipation from PCB systems to increase reliability
    • Single-component, does not require mixing
    • Good fluidity
    • After dispensing, it is capable of flowing, filling or self-leveling
    • Faster inline machining with optional thermal acceleration
    • No solvent added
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • UV indicator enables automatic inspection
    • No solvent added
    • Polymerization at room temperature
    • Slight thermal acceleration can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Soft coating improves reliability against stresses
    • No solvent added
    • Polymerization at room temperature
    • It can speed up in-line processing
    • Good adhesion to many substrates
    • Allows use with many low-solids lead-free solder
    • Improves reliability against stresses
    • Promotes flow and filling of narrow spaces and crevices
    • Mellow
    • Polymerization in rapid RTV
    • Good "green" resistance
    • Single-component - No mixing required
    • Polymerization at room temperature
    • Fast skin time
    • High self-extinguishing
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses