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Tecnologia

Applicazioni

Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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Electrolube AFA Aromatic Free Acrylic Conformal Coating
- Transparent coating with excellent clarity
- UV resistant
- Ideal for LED applications
- Reduces operational risks
- Free of aromatic solvents such as toluene and xylene
- Efficient application of coating at room temperature
- Ideal for applications requiring rework
- Can be removed with ULS
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Electrolube ER2183 Epoxy Resin
- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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Electrolube ER2188 Epoxy Resin
- General purpose epoxy resin
- Economic solution
- Good chemical and water resistance
- Excellent adhesion to a wide variety of substrates
- Excellent electrical properties
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Electrolube ER2219 Epoxy Resin
- One-component epoxy encapsulant
- Semi-thixotropic
- Effective polymerization quickly
- High ionic purity
- Low ionizable chlorine content
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Electrolube ER2220 Epoxy Resin
- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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Electrolube ER2221 Epoxy Resin
- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
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Electrolube FPC Fluorinated Polymer Conformal Coating
- Very low surface energy
- Repels hydrocarbon and silicone oils
- Low solids content
- Low film strength once cured
- Connectors do not require masking
- Promotes economical and efficient application
- Fast drying time
- Simple coating procedure
- Non-flammable coating that contains a UV trace
- Ensures the quality of the coating by visual inspection
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Electrolube HTCP Non-Silicone Heat Transfer Compound Plus
- High thermal conductivity
- Optimal heat dissipation
- Low viscosity for easy application
- Used as thermal interface material
- Based on a non-silicone oil
- Avoids migration problems of silicone and siloxane LMW
- Non-curing paste
- Enables simple and efficient rework of components
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Electrolube UR5044 Polyurethane Resin
- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
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Electrolube UR5608 Polyurethane Resin
- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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Electrolube UR5634 Polyurethane Resin
- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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Electrolube UVCL UV Cure Conformal Coating
- Dual polymerization system
- Eliminates the use of solvents
- VOC-free and non-flammable coating
- Does not require dilution
- Low viscosity
- Ready to use for selective spray application
- Maximum protection in harsh environments
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MG Chemicals 8329TCM
- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8329TFF
- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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SYLGARD™ 160 Silicone Elastomer Kit
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity