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Filtri
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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- High thermal conductivity
- Optimal heat dissipation
- Low viscosity for easy application
- Used as thermal interface material
- Based on a non-silicone oil
- Avoids migration problems of silicone and siloxane LMW
- Non-curing paste
- Enables simple and efficient rework of components
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- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
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- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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- Dual polymerization system
- Eliminates the use of solvents
- VOC-free and non-flammable coating
- Does not require dilution
- Low viscosity
- Ready to use for selective spray application
- Maximum protection in harsh environments
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- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties







