Indifferent

    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
    • Rapid polymerization
    • Very low viscosity
    • Controlled volatility of silicone
    • Solvent-free
    • Excellent smoothness, filling or self-leveling after distribution
    • Polymerizes into a soft, low-stress elastomer
    • Coating can improve reliability against stresses
    • Rapid polymerization
    • Sliding
    • Polymerizes into a soft, low-stress elastomer
    • Controlled volatility of silicone
    • No solvent added
    • Polymerization at room temperature
    • Faster processing at room temperature with thermal acceleration
    • Soft coating can improve reliability against stresses
    • Can be used if flame resistance required
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone
    • Polymer matrix helps reduce pump out
    • Fluid
    • Good thermal conductivity
    • Low thermal resistance
    • Does not polymerize
    • Heat removal from PCB system components
    • Possible to obtain bond line thickness (BLT).