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Mostra Nascondi Filtri

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  • DOWSIL™ 3-4241 Dielectric Tough Gel Kit
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    DOWSIL™ 3-4241 Dielectric Tough Gel Kit
    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
  • DOWSIL™ 4535
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    DOWSIL™ 4535
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
  • DOWSIL™ 5515
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    DOWSIL™ 5515
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
  • DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
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    DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
    • Two-part silicone elastomer encapsulant
    • Low thermal vacuum outgassing
    • Physical and electrical stability
    • Wide operating temperature range.
    • Certified to NASA requirements for extreme environment applications.
  • DOWSIL™ EC-8425
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    DOWSIL™ EC-8425
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
  • DOWSIL™ EG-1200 Gel
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    DOWSIL™ EG-1200 Gel
    • Gel is a two-component addition-cure silicone gel
    • Clear and flowable,
    • Designed for optically clear potting and coupling applications in displays and LED lighting systems.
    • High transparency
    • Reduced yellowing
    • High surface adhesion
    • Good stress absorption capacity
    • Provides mechanical protection, electrical insulation and long-term reliability.
    • Can cure at room temperature or with thermal acceleration.
  • DOWSIL™ SE 9187 L Adhesive
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    DOWSIL™ SE 9187 L Adhesive
    • Rapid polymerization
    • Very low viscosity
    • Controlled volatility of silicone
    • Solvent-free
    • Excellent smoothness, filling or self-leveling after distribution
    • Polymerizes into a soft, low-stress elastomer
    • Coating can improve reliability against stresses
  • DOWSIL™ SE 9189 L RTV
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    DOWSIL™ SE 9189 L RTV
    • Rapid polymerization
    • Sliding
    • Polymerizes into a soft, low-stress elastomer
    • Controlled volatility of silicone
    • No solvent added
    • Polymerization at room temperature
    • Faster processing at room temperature with thermal acceleration
    • Soft coating can improve reliability against stresses
    • Can be used if flame resistance required
  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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    DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone
  • DOWSIL™ TC-5121C LV Thermally Conductive Compound
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    DOWSIL™ TC-5121C LV Thermally Conductive Compound
    • Polymer matrix helps reduce pump out
    • Fluid
    • Good thermal conductivity
    • Low thermal resistance
    • Does not polymerize
    • Heat removal from PCB system components
    • Possible to obtain bond line thickness (BLT).