<0.5 W/m·K

Showing all 3 results

Read more Quick View
MG Chemicals 832FX
- Black, flexible two-part epoxy compound
- Designed to reduce physical stress on components
- Suitable for low-temperature environments and applications subject to thermal cycling or rapid temperature changes
- Mixing ratio 1:1 by volume
- Very low mixed viscosity of 700 cP
- Good adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and moisture, even when submerged
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
Read more Quick View
MG Chemicals 832HD
- Black, rigid two-part epoxy resin
- PCB potting compound
- Capable of filling small gaps and cavities
- Mixing ratio 1:1 by volume
- Low mixed viscosity of 4,100 cP
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
- Room temperature or heat-accelerated curing
Read more Quick View
MG Chemicals 9510 One-Part Epoxy Potting Compound
- One-part epoxy potting compound
- Black and rigid
- Ready to use, requires no mixing
- Unlimited working life at room temperature
- Heat cure from 80 °C
- Low viscosity of 4,800 cP
- Excellent chemical resistance
- Excellent electrical insulation
- High tensile and compressive strength
- Excellent adhesion to metals, composites, glass, ceramics, and many plastics
- Water and humidity resistant
- Solvent-free