Electronics

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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CRC Contact Clean & Protect
- Electrical contact cleaning oil
- Removes corrosion and oxidation (oxides, sulfates, sulfides, carbonates)
- Dissolves grease, oil, and resinous contamination
- Rapid evaporation
- Non-corrosive
- Contains corrosion inhibitor
- Provides long-lasting lubrication
- Protects contacts after cleaning
- Safe on metal surfaces (non-staining)
- Safe on most rubbers, plastics, and coatings
- (preliminary testing recommended on sensitive materials)
- 360° spray valve (can be used upside down)
- High-purity CO₂ propellant (95% active content)
- Do not use on energized equipment
- Professional technical spray
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CRC Contact Cleaner
- Precision cleaner for electrical and electronic contacts
- Removes dirt, residues and contaminants from contacts
- Leaves no residue after application
- Fast drying
- Suitable for cleaning electronic boards
- Specific for electrical and electronic equipment
- Non-corrosive
- Developed for components that do not tolerate aqueous cleaners
- Do not use on energized equipment
- Professional technical spray
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DOWSIL™ 1-4105 Conformal Coating
- Single-component silicone conformal coating
- Transparent
- Thermal polymerization
- Designed for the protection of rigid and flexible printed circuit boards.
- Low viscosity
- Without added solvents
- Cures into a soft, low-stress elastomer, reducing stress on electronic components.
- Incorporates a UV indicator to facilitate automated inspection
- UL, IPC and MIL certified.
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DOWSIL™ 3-6265 HP Adhesive
- Black one-component silicone adhesive
- Thixotropic and non-sagging
- Thermal addition cure polymerization
- High tensile strength
- Reduced void formation after curing, even on sensitive substrates
- UL 94 V-0 rated
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DOWSIL™ 3-6548 Silicone RTV Foam
- Two-component fire-resistant RTV silicone foam
- Two-component room temperature vulcanizing (RTV) silicone foam
- Fire resistant
- Good flexibility even under severe operating conditions
- Withstand high temperatures
- Designed to limit hazards such as smoke, flames and gases.
- Expands and cures at room temperature to form a closed-cell foam elastomer.
- Designed for creating fire-resistant seals in penetrations and linear joints.
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DOWSIL™ 3810 EG
- One-part dielectric gel
- Transparent
- Hot polymerization
- Low viscosity
- Very soft gel
- Suitable for PCB potting and electronic component protection
- Electrical insulation and environmental protection
- Extended temperature range (-60°C / +200°C)
- No mixing required
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DOWSIL™ 4535
- No exotherm during curing
- Room temperature or heat-accelerated polymerization
- High stability during thermal cycles up to 150°C (peak 175°C)
- Maintains vertical position
- Controlled low silicone volatility
- Soft and elastomeric material after polymerization
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DOWSIL™ 5351
- Non-curing
- High thermal conductivity
- Stable on vertical surfaces
- Gap filling capacity up to 1.0 mm
- Thermally conductive silicone material
- Low thermal resistance and good high-temperature stability
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DOWSIL™ 5515
- Low density
- Room temperature or heat-accelerated polymerization
- Non-sagging, stable even on vertical surfaces
- Soft and deformable material with stress relief function
- Slightly tacky surface after curing
- No exotherm during curing
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DOWSIL™ 5888
- Non-curing
- High thermal conductivity
- Low thermal resistance
- Solvent-free formulation
- Thixotropic - low flowability
- Applicable via screen printing, stencil or dispensing
- Ability to achieve thin thicknesses
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DOWSIL™ 6-1125 Controlled Volatility Sealant
- One-part condensation cure silicone sealant
- Space grade
- Non-sag
- Low controlled volatility
- Cures at room temperature upon exposure to moisture
- Does not require mixing
- Designed for aerospace applications
- Provides high elongation
- Good physical and electrical stability
- Complies with NASA low outgassing requirements
- Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
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DOWSIL™ CC 2588
- Medium viscosity
- Abrasion-resistant elastoplastic surface
- Solvent-based coating
- High solid content
- UV indicator for inspection
- Room temperature vulcanization (RTV)
- Good adhesion on rigid and flexible PCBs
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DOWSIL™ CC 8030 UV
- Low viscosity, spray applicable
- Fast UV cure with secondary moisture cure
- Solvent-free
- UV indicator for inspection
- Good adhesion to PCB materials
- Reduced oxygen inhibition
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DOWSIL™ CC-3122 Conformal Coating
- One-component silicone conformal coating
- Translucent
- Low viscosity
- Moisture cure (RTV)
- Solvent-free
- Provides environmental resistance
- Dielectric protection
- Long-term reliability even in harsh environmental conditions
- UL recognized and includes a UV indicator for coating inspection.
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DOWSIL™ EA-6060 Adhesive
- Two-part silicone adhesive
- Non-sag
- Fast low-temperature cure
- Accelerated cure at moderate temperature (80 °C)
- Rapid adhesion development.
- The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
- Maintains physical and electrical properties across a wide range of operating conditions.
- Primerless adhesion
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DOWSIL™ EC-8425
- High electrical conductivity (silver-based filler)
- Electromagnetic shielding (EMC) over a wide frequency range
- High elongation for stress relief (>20%)
- Non-slump adhesive (non-flowable)
- UV traceability for inspection
- Good adhesion on various substrates
- Solvent-free formulation
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DOWSIL™ EG-1200 Gel
- Gel is a two-component addition-cure silicone gel
- Clear and flowable,
- Designed for optically clear potting and coupling applications in displays and LED lighting systems.
- High transparency
- Reduced yellowing
- High surface adhesion
- Good stress absorption capacity
- Provides mechanical protection, electrical insulation and long-term reliability.
- Can cure at room temperature or with thermal acceleration.
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DOWSIL™ MS-1002 Moldable Silicone
- Two-component 1:1 optical silicone
- Molding resin for optical applications
- High light transmittance
- Low chromatic dispersion
- UV and heat resistant
- High surface detail replication
- High Shore A
- Fast heat curing
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DOWSIL™ SE 4420
- Polymerization at room temperature
- Good adhesion on various substrates
- Fast tack-free time
- Elastomeric material with high elongation
- Suitable for bonding, sealing and thermal dissipation
- Good mechanical strength
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MG Chemicals 8329TCM
- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons