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DOWSIL™ 3140 RTV Coating
Single-component
Does not require mixing
Good fluidity
Capable of flowing, filling or self-leveling
Polymerization at room temperature
No solvent added
UV indicator for manual and automatic inspections
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
Mellow
High tensile strength and elongation resistance
High thermal stability
Single component - Does not require mixing
Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
Mellow
Polymerization in rapid RTV
Good "green" resistance
Single-component - No mixing required
Polymerization at room temperature
Fast skin time
High self-extinguishing
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DOWSIL™ 340 Heat Sink Compound
Not smooth
Moderate thermal conductivity
Does not require ovens or curing
Heat flow away from circuit components can increase reliability
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DOWSIL™ 3522 Cleaning Solvent Concentrated
Rapid digestion of cured silicone sealant
Non-halogenated solvent
Non-flammable
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DOWSIL™ 3525 Adhesive Sealant
Adhesion to metals and plastics
Weathering resistance
UV resistance
Non-corrosive
Neutral polymerization
Not oily
Ready to use
Short time of no adherence
Solvent-free: low shrinkage
Good mechanical properties: high
Tear resistance
Elongation resistance
Tensile strength
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DOWSIL™ 3810 EG
One-part dielectric gel
Transparent
Hot polymerization
Low viscosity
Very soft gel
Suitable for PCB potting and electronic component protection
Electrical insulation and environmental protection
Extended temperature range (-60°C / +200°C)
No mixing required
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DOWSIL™ 4535
No exotherm during curing
Room temperature or heat-accelerated polymerization
High stability during thermal cycles up to 150°C (peak 175°C)
Maintains vertical position
Controlled low silicone volatility
Soft and elastomeric material after polymerization
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DOWSIL™ 5351
Non-curing
High thermal conductivity
Stable on vertical surfaces
Gap filling capacity up to 1.0 mm
Thermally conductive silicone material
Low thermal resistance and good high-temperature stability
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DOWSIL™ 5515
Low density
Room temperature or heat-accelerated polymerization
Non-sagging, stable even on vertical surfaces
Soft and deformable material with stress relief function
Slightly tacky surface after curing
No exotherm during curing
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DOWSIL™ 5888
Non-curing
High thermal conductivity
Low thermal resistance
Solvent-free formulation
Thixotropic - low flowability
Applicable via screen printing, stencil or dispensing
Ability to achieve thin thicknesses
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DOWSIL™ 6-1104 Controlled Volatility Sealant
Not smooth
Low levels of volatile condensable materials
High elongation for greater stress reduction
No mixing required
Faster inline machining with optional thermal acceleration
Proven for space applications
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DOWSIL™ 6-1125 Controlled Volatility Sealant
One-part condensation cure silicone sealant
Space grade
Non-sag
Low controlled volatility
Cures at room temperature upon exposure to moisture
Does not require mixing
Designed for aerospace applications
Provides high elongation
Good physical and electrical stability
Complies with NASA low outgassing requirements
Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
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DOWSIL™ 7091 Adhesive Sealant
One-component adhesive sealant
Cures at room temperature when exposed to air humidity
Alkoxyl polymerization system
Pasty and non-sagging consistency
Easy to apply
Cures into a durable and flexible rubber
Excellent adhesion to many substrates
Stable and flexible from -40°C (-40°F) to 180°C (356°F)
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DOWSIL™ 7092 High Green Strength Adhesive and Sealant
Provides instant green force
Easy-to-use one-component adhesive sealant
Cures at room temperature when exposed to air humidity
Excellent adhesion to a wide range of substrates such as glass, metals and plastics
Pasty and non-sticky consistency
Cures into a durable and flexible rubber
Stable and flexible from -50°C to +150°C
UL 94 HB
Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
Saves time because no buffer is needed for increasing resistance
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DOWSIL™ 7093 Adhesive Sealant
One-component adhesive sealant
Cures at room temperature when exposed to moisture in the air
Alkoxy polymerization system
Pasty consistency, does not bag
Easy to apply
Low modulus for high movement capacity
Good adhesion on many substrates
Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
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DOWSIL™ 7094 Flowable Sealant
One-component adhesive sealant
Cures at room temperature when exposed to air humidity
Alkoxyl polymerization system
Fluid and self-leveling
Easy to apply
Excellent primerless adhesion to many substrates
Stable and flexible from -50°C to +180°C
Non-corrosive to metals
Low odor
Primerless adhesion to mixed substrates
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DOWSIL™ 730 FS Solvent Resistant Sealant
One-component fluorosilicone sealant adhesive.
It cures at room temperature when
exposed to moisture in the air
Acetoxy polymerization system
Pasty and non-sagging consistency
Easy to apply
Cures into a durable and flexible rubber
Good adhesion to many substrates
Stable and flexible from -65°C (-85°F) to 260°C (500°F)
Retains its properties when exposed to fuels, oils and solvents
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DOWSIL™ 732 Multi-Purpose Sealant
One-component adhesive sealant
Cures at room temperature when exposed to air humidity
Acetoxy polymerization system
Pasty and non-sagging consistency
Easy to apply
Cures into a durable and flexible rubber
Good adhesion to many substrates
Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
Excellent dielectric properties
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DOWSIL™ 734 Flowable Sealant
One-component adhesive sealant
Cures at room temperature when exposed to air humidity
Acetoxy polymerization system
Fluid and self-leveling
Easy to apply
Cures into a durable and flexible rubber
Rapid no-grip time
Good adhesion to many substrates
Stable and flexible from -65°C (-85°F) to +180°C (+356°F)
Excellent dielectric properties
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