Dowsil

Showing 41–60 of 104 results

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DOWSIL™ 736 Heat Resistant Sealant
- It does not sag and drip
- Can be applied overhead or on side walls
- Can be used in applications with continuous exposure at 260°C (500°F) and intermittent exposure at 315°C (600°F)
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DOWSIL™ 738 Electrical Sealant
- Not smooth
- Polymerization at room temperature
- High elongation for greater stress reduction
- No mixing required
- Polymerization at room temperature, no need for ovens
- Faster inline machining with optional thermal acceleration
- Improved reliability through reduced curing stresses
- Automated or manual needle dispensing systems
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DOWSIL™ 739 Plastic Adhesive
- Mellow
- High elongation by stress reduction
- Single-component - No mixing required
- Polymerization at room temperature
- High self-extinguishing
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DOWSIL™ 744 RTV Adhesive Sealant
- Cures at room temperature
- Pasty consistency
- It does not drip
- Easy to apply
- High elongation
- Stable and flexible over a wide temperature range
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DOWSIL™ 748 Non-Corrosive Sealant
- Can be used in corrosion-sensitive electrical equipment and PCB systems without adverse effects
- Easy to handle
- UL Classified
- Non-corrosive
- Low odor
- Cures at room temperature
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DOWSIL™ 752 Adhesive Sealant
- Single-component adhesive/sealant
- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Good adhesion on many substrates
- Stable and flexible from -50°C (-58°F) to 180°C (356°F)
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DOWSIL™ 832 Multi-Surface Adhesive Sealant
- 100% silicone
- Superior adhesion to a wide variety of surfaces
- Low odor
- Neutral polymerization (alcohol)
- Does not corrode metal or other sensitive materials
- Forms a flexible and long-lasting seal
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DOWSIL™ 866 Primerless Silicone Adhesive
- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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DOWSIL™ 92-023 Primer
- Improves the inhibition resistance of addition-cured silicones
- Diluted in heptane
- Most metals, glass and ceramics
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DOWSIL™ 93-006-1 RF Sealant & Kit
- High viscosity
- Lump-free
- High performance
- Adheres well to primed surfaces
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DOWSIL™ 93-076 RF Aerospace Sealant

Good tensile strength High adhesive capacity Low thermal conductivity Good weather resistance Two-component with room temperature curing Stable even at high temperatures
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DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
- Two-part silicone elastomer encapsulant
- Low thermal vacuum outgassing
- Physical and electrical stability
- Wide operating temperature range.
- Certified to NASA requirements for extreme environment applications.
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DOWSIL™ AS 7096N Sealant Clear
- Single-component adhesive/sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Excellent primerless adhesion to many substrates
- Non-corrosive for metals
- Stable and flexible from -50°C to +150°C
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DOWSIL™ CC 2588
- Medium viscosity
- Abrasion-resistant elastoplastic surface
- Solvent-based coating
- High solid content
- UV indicator for inspection
- Room temperature vulcanization (RTV)
- Good adhesion on rigid and flexible PCBs
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DOWSIL™ CC 8030 UV
- Low viscosity, spray applicable
- Fast UV cure with secondary moisture cure
- Solvent-free
- UV indicator for inspection
- Good adhesion to PCB materials
- Reduced oxygen inhibition
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DOWSIL™ CC-3122 Conformal Coating
- One-component silicone conformal coating
- Translucent
- Low viscosity
- Moisture cure (RTV)
- Solvent-free
- Provides environmental resistance
- Dielectric protection
- Long-term reliability even in harsh environmental conditions
- UL recognized and includes a UV indicator for coating inspection.
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ DA-6534 Adhesive
- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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DOWSIL™ EA-2626 / Silastic™ Q3-3636
- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization
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DOWSIL™ EA-2626 Adhesive
- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization