Dowsil

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Can be used in corrosion-sensitive electrical equipment and PCB systems without adverse effects
    • Easy to handle
    • UL Classified
    • Non-corrosive
    • Low odor
    • Cures at room temperature
    • Single-component adhesive/sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion on many substrates
    • Stable and flexible from -50°C (-58°F) to 180°C (356°F)
    • 100% silicone
    • Superior adhesion to a wide variety of surfaces
    • Low odor
    • Neutral polymerization (alcohol)
    • Does not corrode metal or other sensitive materials
    • Forms a flexible and long-lasting seal
    • Hot polymerization
    • High tensile strength
    • Single component - Does not require mixing
    • Fast and versatile curing with heat input fill or self-leveling after deployment
    • Improves the inhibition resistance of addition-cured silicones
    • Diluted in heptane
    • Most metals, glass and ceramics
    • High viscosity
    • Lump-free
    • High performance
    • Adheres well to primed surfaces
  • Good tensile strength High adhesive capacity Low thermal conductivity Good resistance to weathering Two-component with room temperature curing Stable even at high temperatures
    • Single-component adhesive/sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Excellent primerless adhesion to many substrates
    • Non-corrosive for metals
    • Stable and flexible from -50°C to +150°C
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
    • Low viscosity
    • Good thermal conductivity
    • Mixing ratio 1 to 1
    • Polymerization at room temperature
    • Easy to mix and use
    • Good smoothness for fast processing and short cycle times
    • Promotes heat dissipation
    • Low ionic impurities
    • Very high thermal conductivity
    • Loaded silver
    • Good adhesion to Ni, Al, laminate and silicon
    • Microelectronic grade material
    • High electroconductive performance
    • Good adhesive performance for TIM1 applications
    • Two-component adhesive sealant
    • Rapid polymerization at room temperature
    • Neutral alkoxide polymerization
    • Pasty, non-self-levelling consistency
    • Good and durable adhesion
    • Excellent weather, UV and heat resistance up to 190°C
    • Rapid curing allows rapid handling of bonded components
    • Deep polymerization
    • Two-component adhesive sealant
    • Rapid polymerization at room temperature
    • Neutral alkoxide polymerization
    • Pasty, non-self-levelling consistency
    • Good and durable adhesion
    • Excellent weather, UV and heat resistance up to 190°C
    • Rapid curing allows rapid handling of bonded components
    • Deep polymerization
    • Fast and homogeneous deep polymerization
    • Early adhesion at room temperature
    • Pasty, non-self-levelling consistency
    • Rapid handling of bonded components
    • Fast assembly process
    • Durable adhesion to a wide variety of substrates
    • Excellent resistance to weathering and U.V. rays.
  • No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
    • Electromagnetic shielding
    • Easy to dose and cure at room temperature
    • Dow's unique formulation enables adhesion to a variety of substrates
    • Durable mechanical and conductive properties, reliable performance
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
    • Reduces pressure on components
    • Effectively dissipates heat
    • Avoids delamination problems
    • The rapid polymerization
    • Optimized processing time
    • Allows for the implementation of complex projects
    • No additional dielectric barrier required
    • Allows for quick filling
    • It is suitable for high-throughput production processes.
    • Filling allows easy control of the process
    • Meets certification requirements
    • Polymerization at room temperature
    • Low viscosity - ease of processing
    • Self-adhesive - no primer required
    • Reliable optical performance in difficult conditions