Dowsil

Showing 61–80 of 104 results

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DOWSIL™ EA-3838 Fast Adhesive
- Fast and homogeneous deep polymerization
- Early adhesion at room temperature
- Pasty, non-self-levelling consistency
- Rapid handling of bonded components
- Fast assembly process
- Durable adhesion to a wide variety of substrates
- Excellent resistance to weathering and U.V. rays.
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DOWSIL™ EA-6060 Adhesive
- Two-part silicone adhesive
- Non-sag
- Fast low-temperature cure
- Accelerated cure at moderate temperature (80 °C)
- Rapid adhesion development.
- The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
- Maintains physical and electrical properties across a wide range of operating conditions.
- Primerless adhesion
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DOWSIL™ EA-9189 H White RTV Adhesive

No mixing required No reaction exotherm during curing Excellent primerless adhesion on many substrates Excellent performance across a wide temperature range Cures into soft, low-stress elastomers Controlled volatility (controlled silane migration)
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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DOWSIL™ EC-8425
- High electrical conductivity (silver-based filler)
- Electromagnetic shielding (EMC) over a wide frequency range
- High elongation for stress relief (>20%)
- Non-slump adhesive (non-flowable)
- UV traceability for inspection
- Good adhesion on various substrates
- Solvent-free formulation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ EG-1200 Gel
- Gel is a two-component addition-cure silicone gel
- Clear and flowable,
- Designed for optically clear potting and coupling applications in displays and LED lighting systems.
- High transparency
- Reduced yellowing
- High surface adhesion
- Good stress absorption capacity
- Provides mechanical protection, electrical insulation and long-term reliability.
- Can cure at room temperature or with thermal acceleration.
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ FIRESTOP 700 Silicone Sealant
- Meets BS 476 Part 22 standard
- Excellent primerless adhesion on most substrates
- porous and non-porous buildings
- It does not drip
- Joint movement capacity ±50%
- Neutral curing system
- Halogen-free
- Complies with ISO 11600-F&G-25LM Standard
- A fire resistance value of up to 4 hours can be obtained
- Extensively tested on many European specifications
- Out of footprint in 1.5 hours
- Excellent weathering characteristics, including resistance to ozone, UV radiation and extreme temperatures
- Long service life
- CE marked as fire resistant according to ETAG 026
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DOWSIL™ MS-1002 Moldable Silicone
- Two-component 1:1 optical silicone
- Molding resin for optical applications
- High light transmittance
- Low chromatic dispersion
- UV and heat resistant
- High surface detail replication
- High Shore A
- Fast heat curing
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DOWSIL™ PR-1200 RTV Prime Coat
- One-component clear primer
- Dispersed in naphtha
- Improves adhesion of RTV and thermosetting silicones to many substrates
- Can be used on most substrates
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DOWSIL™ PR-1204 RTV Prime Coat
- Improves the adhesion of RTV and thermosetting silicones
- Improves the adhesion of many wet-cure RTV silicones
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DOWSIL™ PR-2260 Prime Coat
- Improves the adhesion of RTV and thermoset silicones to substrates
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DOWSIL™ Q3-1566 Heat Resistant Adhesive/ Sealant
- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Good adhesion on many substrates
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DOWSIL™ Q3-3526 Base and Catalyst
- Rapid handling of bonded components: rapidly develops adhesive strength at room temperature, enabling rapid handling of components.
- Adheres to suitably prepared polypropylene.
- Two-component system with 10:1 mixture ratio by weight. Non-corrosive and low-odor curing.
- It contains no solvents.
- The non-lumpy nature of the mixture allows the extruded bead to remain in place without flowing.
- Excellent resistance to weathering, UV rays and heat up to 190°C.
- Available in two color versions: Gray (RAL 7038) and Black (RAL 7016).
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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DOWSIL™ Q4-2805 Fluorosilicone Channel Sealant
- Superior sealing characteristics when exposed to fuels and oils
- Easily injected and reinjected
- Does not harden
- Good grip
- Essentially unaffected by shock, vibration, and thermal cycling
- Contains no hardeners or curing agents
- Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
- Contains flow control particles
- Excellent flow characteristics allow faster injection at lower pressures.
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ R41 Cleaner Plus
- Cleaning solvent
- Contains a special catalyst for adhesion preparation
- Easy to apply
- Ready to use
- Cleaning and surface preparation in one step
- Increased security
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DOWSIL™ SC 102 Compound
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components