Dowsil
Showing 61–80 of 84 results
Filtri
Tipo di prodotto
- 1 Cleaner
- 10 Conformal coating
- 28 Elastomeric adhesive
- 16 Electronics adhesive
- 2 Gap filler
- 6 Gel
- 10 Heat-conductive adhesive
- 5 Primer
- 4 Resins and encapsulants
- 1 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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- Cleaning solvent
- Contains a special catalyst for adhesion preparation
- Easy to apply
- Ready to use
- Cleaning and surface preparation in one step
- Increased security
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- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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- Rapid polymerization
- Very low viscosity
- Controlled volatility of silicone
- Solvent-free
- Excellent smoothness, filling or self-leveling after distribution
- Polymerizes into a soft, low-stress elastomer
- Coating can improve reliability against stresses
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- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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- Rapid polymerization
- Sliding
- Polymerizes into a soft, low-stress elastomer
- Controlled volatility of silicone
- No solvent added
- Polymerization at room temperature
- Faster processing at room temperature with thermal acceleration
- Soft coating can improve reliability against stresses
- Can be used if flame resistance required
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- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Good adhesion on many substrates
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- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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- Good thermal conductivity
- Low oil bleed
- Stable at high temperatures
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- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
