Dowsil
Showing 81–84 of 84 results
Filtri
Tipo di prodotto
- 1 Cleaner
- 10 Conformal coating
- 28 Elastomeric adhesive
- 16 Electronics adhesive
- 2 Gap filler
- 6 Gel
- 10 Heat-conductive adhesive
- 5 Primer
- 4 Resins and encapsulants
- 1 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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- Long processing time
- Resistant to fuels and solvents
- Offers processing flexibility
- Used where resistance to fuels or solvents is required
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- Addition-curing two-component silicone elastomer
- Easy-to-use and easy-to-manage 1:1 mixing ratio
- High tear resistance
- Low compression set
- Good adhesion to many substrates
- Hardness suitable for sealing applications with high clamping loads
- The non-sagging nature allows for accurate and uniform seal beads of precise dimensions as defined by the robot application parameters.
- Does not require solvents, CFCs or other environmentally harmful materials for processing
