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Showing 21–40 of 58 results

Tipo di prodotto

1 Conductive paints Conductive paints
5 Conformal coating Conformal coating
1 Gap filler Gap filler
4 Gel Gel
3 Heat-conductive adhesive Heat-conductive adhesive
11 Resins and encapsulants Resins and encapsulants
1 Thermal conductive paste Thermal conductive paste

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Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ 3-6371 UV Gel
- UV curing in 1 part
- Very soft
- Suitable for very low temperatures
- Does not require mixing
- UV rays for fast processing speed
- Polymerization secondary to moisture
- The gel remains flexible even at very low temperatures
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9157 Conformal Coating
- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ SE 9187 L Adhesive
- Rapid polymerization
- Very low viscosity
- Controlled volatility of silicone
- Solvent-free
- Excellent smoothness, filling or self-leveling after distribution
- Polymerizes into a soft, low-stress elastomer
- Coating can improve reliability against stresses
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DOWSIL™ SE 9189 L RTV
- Rapid polymerization
- Sliding
- Polymerizes into a soft, low-stress elastomer
- Controlled volatility of silicone
- No solvent added
- Polymerization at room temperature
- Faster processing at room temperature with thermal acceleration
- Soft coating can improve reliability against stresses
- Can be used if flame resistance required
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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Electrolube ER1122 Epoxy Resin
- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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Electrolube RTV Thermally Conductive Oxime
- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
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EPIBOND® 115 A/B
- High-temperature structural epoxy adhesive
- Two-component epoxy adhesive
- Service up to 149°C (300°F)
- High shear strength on metals and composites
- Thixotropic gap-filling paste
- Contains 125-micron spacer beads
- High Tg
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EPIBOND® 215 A/B
- High-strength structural epoxy adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Fast handling strength
- Good performance retention after environmental aging and chemical immersion
- SVHC-free according to REACH
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EPIBOND® 420 A/B
- Structural applications
- Room temperature curing paste
- High toughness and resilience
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EPOCAST® 1614-A3
- Syntactic structural epoxy adhesive
- Single-component supplied frozen
- Paste consistency after thawing
- Extrudable with standard equipment
- Designed for structural applications on honeycomb
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EPOCAST® 1617 A/B
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Good mechanical strength-to-density ratio
- Suitable for structural applications
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EPOCAST® 1618 D/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures