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Showing 21–28 of 28 results
Filtri
Tipo di prodotto
- 1 Conductive paints
- 5 Conformal coating
- 1 Gap filler
- 4 Gel
- 3 Heat-conductive adhesive
- 11 Resins and encapsulants
- 1 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
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- Provides >52 dB RFI shielding at frequencies <1 MHz
- Excellent adhesion to plastics
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene or xylene
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- UL Recognized (File No. E202609)
- Provides effective EMI/RFI shielding over a wide range of frequencies
- Strong corrosion resistance
- Gentle and safe solvent system on polystyrenes
- HAP free-does not contain toluene, xylene, or MEK
- Available in aerosol format
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- Provides superior EMI shielding
- Excellent adhesion to plastics
- Minimum height of thin layer
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene, xylene or MEK
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- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range
