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Showing 21–28 of 28 results

Product type

1 Conductive paints Conductive paints
5 Conformal coating Conformal coating
1 Gap filler Gap filler
4 Gel Gel
3 Heat-conductive adhesive Heat-conductive adhesive
11 Resins and encapsulants Resins and encapsulants
1 Thermal conductive paste Thermal conductive paste

Technology

Applications

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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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Electrolube ER1122 Epoxy Resin
- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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Electrolube RTV Thermally Conductive Oxime
- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
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MG Chemicals 838AR
- Provides >52 dB RFI shielding at frequencies <1 MHz
- Excellent adhesion to plastics
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene or xylene
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MG Chemicals 841AR
- UL Recognized (File No. E202609)
- Provides effective EMI/RFI shielding over a wide range of frequencies
- Strong corrosion resistance
- Gentle and safe solvent system on polystyrenes
- HAP free-does not contain toluene, xylene, or MEK
- Available in aerosol format
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MG Chemicals 842AR
- Provides superior EMI shielding
- Excellent adhesion to plastics
- Minimum height of thin layer
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene, xylene or MEK
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SYLGARD™ 527 A&B Silicone Dielectric Gel
- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range

Cold

Filtri

Product type

Technology

Applications

DOWSIL™ TC-5026 Thermally Conductive Compound

DOWSIL™ TC-6020 Thermally Conductive Encapsulant

Electrolube ER1122 Epoxy Resin

Electrolube RTV Thermally Conductive Oxime

MG Chemicals 838AR

MG Chemicals 841AR

MG Chemicals 842AR

SYLGARD™ 527 A&B Silicone Dielectric Gel

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