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Tipo di prodotto
- 5 Conformal coating
- 5 Electrically conductive adhesives
- 1 Gap filler
- 4 Gel
- 1 Heat-conductive adhesive
- 5 Resins and encapsulants
- 1 Thermal conductive paste
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Applicazioni
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- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
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- Single-component, does not require mixing
- Good fluidity
- After dispensing, it is capable of flowing, filling or self-leveling
- Faster inline machining with optional thermal acceleration
- No solvent added
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
- UV indicator enables automatic inspection
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- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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- Provides excellent adhesion to all substrates
- Good temperature range and dielectric properties
- Can be welded through the UV track for easy inspection
- Can be removed with solvents such as Ultrasolve (ULS)
- Cheap
- Enables efficient application
- Fast drying time
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- Alkyd conformal coating
- Low VOC
- Specific for the protection of electronic circuits
- Suitable for use in extreme temperatures
- Better performance at high temperatures
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- Allows the PCB design to be camouflaged
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents from the automotive and aerospace industries
- The hardened coating can be removed with Electrolube
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- Minimizes circuit board design
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents in aerospace and automotive industries
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- One-component epoxy encapsulant
- Semi-thixotropic
- Effective polymerization quickly
- High ionic purity
- Low ionizable chlorine content
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- Long processing time
- Resistant to fuels and solvents
- Offers processing flexibility
- Used where resistance to fuels or solvents is required
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- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substratesStorage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- Low outgassing approved by NASA
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- Low outgassing approved by NASA
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
