-45°C / +150°C

Mostra Nascondi Filtri

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

  • DOWSIL™ 5351
    Read more Quick View

    DOWSIL™ 5351
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
  • DOWSIL™ 5515
    Read more Quick View

    DOWSIL™ 5515
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
  • DOWSIL™ 5888
    Read more Quick View

    DOWSIL™ 5888
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses