1.1 MPa

Mostra Nascondi Filtri

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

  • DOWSIL™ 3810 EG
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    DOWSIL™ 3810 EG
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
  • DOWSIL™ 4535
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    DOWSIL™ 4535
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
  • DOWSIL™ 5351
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    DOWSIL™ 5351
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
  • DOWSIL™ 5515
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    DOWSIL™ 5515
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
  • DOWSIL™ 5888
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    DOWSIL™ 5888
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
  • DOWSIL™ CC 2588
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    DOWSIL™ CC 2588
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
  • DOWSIL™ CC 8030 UV
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    DOWSIL™ CC 8030 UV
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
  • DOWSIL™ EC-8425
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    DOWSIL™ EC-8425
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
  • DOWSIL™ SE 4420
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    DOWSIL™ SE 4420
    • Polymerization at room temperature
    • Good adhesion on various substrates
    • Fast tack-free time
    • Elastomeric material with high elongation
    • Suitable for bonding, sealing and thermal dissipation
    • Good mechanical strength
  • H.B. Fuller prodotti
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    Ködisil 110T
    • Oximal cross-linking transparent silicone sealant
    • High resistance to UV, aging and weathering
    • Excellent permanent elasticity
    • Excellent adhesion on glass, metal, plastic and paint
    • Odorless, MEKO-free
    • Compatible with painted surfaces
    • Non-corrosive