Aluminum

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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ARALDITE® 1570 FST A/B
- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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ARALDITE® 501 A/B
- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
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BETAFILL™ 10210
- They are excellent sealants for automotive repair.
- They allow gluing, grouting and sealing.
- Compatible with almost all paint systems.
- DOW AUTOMOTIVE products are developed in collaboration with the houses
- automotive.
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BETAFILL™ 10211
- They are excellent sealants for automotive repair.
- They allow gluing, grouting and sealing.
- Compatible with almost all paint systems.
- DOW AUTOMOTIVE products are developed in cooperation with automakers.
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BETAFILL™ 10215
- They are excellent sealants for automotive repair.
- They allow gluing, grouting and sealing.
- Compatible with almost all paint systems.
- DOW AUTOMOTIVE products are developed in cooperation with automakers.
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Born2Bond™ Flex
- Hardens in 5-10 minutes
- Elongation > 200 %
- Absorbs shock and vibration
- High resistance to peeling
- Bonding a wide range of materials including glass
- Translucent, low efflorescence
- Gel consistency for precise application
- Non-drip for vertical applications
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Born2Bond™ Gasketing GA-18
- Medium strength
- High viscosity / Paste
- Flexible gasket
- Instantaneous low-pressure sealing
- Exceptional resistance to fatigue
- Resistant to vibration
- Corrosion prevention
- Prevents subsidence and micromovements
- Superior power transmission
- Single component
- Suitable for active and passive metals
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Born2Bond™ Gasketing GA-74
- Medium strength
- High viscosity
- Fluorescent
- Instantaneous low-pressure sealing
- Exceptional resistance to fatigue
- Resistant to vibration
- Corrosion prevention
- Prevents subsidence and micromovements
- Superior power transmission
- Single component
- Suitable for active and passive metals
- High pressure seal - 350 bar
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Born2Bond™ Light Lock Gel
- Polymerization: instant and light curing (dual cure)
- Polymerized with visible and UV-LED light
- Long open time without activation
- Curing surfaces dry to the touch and free of stickiness
- On-demand polymerization of excess material released from splice lines
- Bonding, filling, reconstruction and coating
- Low odor and low bloom
- Highly flexible and elastic (Light Lock 30X)
- Adhesion to multiple substrates
- Available in a range of viscosities
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Born2Bond™ Light Lock HV
- Instant and light-curing polymerization (dual cure)
- Fixing time in 60 s (without exposure to light)
- Polymerizable with visible light and UV-LED <5 sec
- Long opening time without activation
- Dry to the touch, surface curing without adhesiveness
- On-demand polymerization of excess material released from weld seams
- Bonding, filling, reconstruction and coating
- Low odor and low effervescence
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Born2Bond™ Repair
- Fixing time in 60 seconds
- Hardens in 5-10 minutes
- Instant adhesion with high bond strength
- Low volumetric contraction: 4.3 percent
- Fills empty spaces of large volumes
- Bonding a wide range of materials
- Workable, sandable and paintable once cured
- Impact resistant
- The gel allows for precise application
- Non-drip for vertical applications
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Born2Bond™ Structural
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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Born2Bond™ Ultra MV
- High adhesion strength
- Long time open
- Low blooming
- Less brittle than conventional instant adhesives
- They glue a wide range of materials, including polystyrene
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DOWSIL™ 3810 EG
- One-part dielectric gel
- Transparent
- Hot polymerization
- Low viscosity
- Very soft gel
- Suitable for PCB potting and electronic component protection
- Electrical insulation and environmental protection
- Extended temperature range (-60°C / +200°C)
- No mixing required
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DOWSIL™ 4535
- No exotherm during curing
- Room temperature or heat-accelerated polymerization
- High stability during thermal cycles up to 150°C (peak 175°C)
- Maintains vertical position
- Controlled low silicone volatility
- Soft and elastomeric material after polymerization
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DOWSIL™ 5351
- Non-curing
- High thermal conductivity
- Stable on vertical surfaces
- Gap filling capacity up to 1.0 mm
- Thermally conductive silicone material
- Low thermal resistance and good high-temperature stability
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DOWSIL™ 5515
- Low density
- Room temperature or heat-accelerated polymerization
- Non-sagging, stable even on vertical surfaces
- Soft and deformable material with stress relief function
- Slightly tacky surface after curing
- No exotherm during curing
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DOWSIL™ 5888
- Non-curing
- High thermal conductivity
- Low thermal resistance
- Solvent-free formulation
- Thixotropic - low flowability
- Applicable via screen printing, stencil or dispensing
- Ability to achieve thin thicknesses
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DOWSIL™ 7091 Adhesive Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
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DOWSIL™ 7092 High Green Strength Adhesive and Sealant
- Provides instant green force
- Easy-to-use one-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Pasty and non-sticky consistency
- Cures into a durable and flexible rubber
- Stable and flexible from -50°C to +150°C
- UL 94 HB
- Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
- Saves time because no buffer is needed for increasing resistance