Resins and encapsulants

Showing 1–20 of 37 results

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Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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Araldite® CW 2245
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
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Araldite® CY 221 / Aradur® HY 2966
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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Araldite® DBF
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
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DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
- Two-part silicone elastomer encapsulant
- Low thermal vacuum outgassing
- Physical and electrical stability
- Wide operating temperature range.
- Certified to NASA requirements for extreme environment applications.
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ MS-1002 Moldable Silicone
- Two-component 1:1 optical silicone
- Molding resin for optical applications
- High light transmittance
- Low chromatic dispersion
- UV and heat resistant
- High surface detail replication
- High Shore A
- Fast heat curing
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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Electrolube ER1122 Epoxy Resin
- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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Electrolube ER2183 Epoxy Resin
- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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Electrolube ER2188 Epoxy Resin
- General purpose epoxy resin
- Economic solution
- Good chemical and water resistance
- Excellent adhesion to a wide variety of substrates
- Excellent electrical properties
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Electrolube ER2219 Epoxy Resin
- One-component epoxy encapsulant
- Semi-thixotropic
- Effective polymerization quickly
- High ionic purity
- Low ionizable chlorine content
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Electrolube ER2220 Epoxy Resin
- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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Electrolube ER2221 Epoxy Resin
- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery