Resins and encapsulants

Showing 21–40 of 41 results

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Electrolube UR5041 Polyurethane Resin
- Excellent resistance to seawater
- High toughness and tear resistance
- Good adhesion to most substrates
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Electrolube UR5044 Polyurethane Resin
- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
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Electrolube UR5118 Polyurethane Resin
- Excellent electrical properties
- Low dielectric constant
- Excellent resistance to seawater
- Very low viscosity
- Rugged and tear-resistant
- Low water absorption
- Excellent resistance to oxidation
- Excellent adhesion
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Electrolube UR5528 Polyurethane Resin
- High degree of toughness
- Adhesion to a wide variety of substrates
- Easy application
- Perfect where moisture ingress is a problem
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Electrolube UR5608 Polyurethane Resin
- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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Electrolube UR5634 Polyurethane Resin
- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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Electrolube UR5635 Polyurethane Resin
- Durable and low viscosity
- Ideal for LED applications
- Mixing ratio 1:1 by volume
- Does not contain IPDI; low-risk material
- Suitable for a wide range of environments
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MG Chemicals 832FX
- Black, flexible two-part epoxy compound
- Designed to reduce physical stress on components
- Suitable for low-temperature environments and applications subject to thermal cycling or rapid temperature changes
- Mixing ratio 1:1 by volume
- Very low mixed viscosity of 700 cP
- Good adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and moisture, even when submerged
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
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MG Chemicals 832HD
- Black, rigid two-part epoxy resin
- PCB potting compound
- Capable of filling small gaps and cavities
- Mixing ratio 1:1 by volume
- Low mixed viscosity of 4,100 cP
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics, and many plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection against electrostatic discharge, vibration, abrasion, thermal shock, salt water, fungus, and harsh chemicals
- Solvent-free
- Room temperature or heat-accelerated curing
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MG Chemicals 832TC
- Black two-component thermally conductive epoxy resin
- Designed for applications where thermal management is a critical factor
- Thermal conductivity of 0.68 W/(m·K)
- Low exotherm
- Mixing ratio 1:1 by volume
- High compressive and tensile strength
- Excellent adhesion to metals, composites, glass, ceramics and numerous plastics
- Excellent electrical insulation properties
- High resistance to water and humidity
- Protection from electrostatic discharge, vibration, abrasion, thermal shock, moisture, salt water, fungus and aggressive chemicals
- Solvent-free
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MG Chemicals 9510 One-Part Epoxy Potting Compound
- One-part epoxy potting compound
- Black and rigid
- Ready to use, requires no mixing
- Unlimited working life at room temperature
- Heat cure from 80 °C
- Low viscosity of 4,800 cP
- Excellent chemical resistance
- Excellent electrical insulation
- High tensile and compressive strength
- Excellent adhesion to metals, composites, glass, ceramics, and many plastics
- Water and humidity resistant
- Solvent-free
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SILASTIC™ FL 60-9201 Fluoro Liquid Silicone Rubber (F-LSR)
- Two-component Fluoro Liquid Silicone Rubber (F-LSR) for liquid injection molding
- High resistance to fuels, oils and solvents
- Chemical and fluid resistance
- Fast-curing platinum technology, without by-products
- Curing over a wide temperature range
- High resistance to high temperatures
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SILASTIC™ RTV-3120 Mould-Making Base
- RTV silicone rubber for moulds, encapsulation and potting
- High mechanical strength
- High Shore hardness
- Very low shrinkage and good dimensional stability
- Good tear propagation resistance
- Suitable for high-temperature casting
- Room temperature curing within 24 hours
- Heat-accelerated curing
- Long mold life
- Highly detailed reproduction
- Simplified handling
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SILASTIC™ RTV-4130-J Base and Curing Agent
- RTV silicone rubber for molds, encapsulation and potting
- High mechanical strength
- High Shore hardness
- Very low shrinkage and good dimensional stability
- Good tear propagation resistance
- Suitable for high-temperature casting
- Room temperature curing within 24 hours
- Heat-accelerated curing
- Long mold life
- Highly detailed reproduction
- Simplified handling
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SILASTIC™ RTV-4230-E Base and Curing Agent
- Two-component addition-cure RTV silicone
- High mechanical strength
- High tear resistance
- High elongation
- Minimal shrinkage (0–0.1%)
- Long pot life
- Cures at room temperature in 24 hours
- Heat-accelerated cure
- Acceptable for food contact
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SYLGARD™ 160 Silicone Elastomer Kit
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 170 Silicone Elastomer Kit
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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SYLGARD™ 184 Silicone Elastomer Kit

Medium viscosity Long open time Good dielectric properties High transparency Room temperature cure Heat-accelerable Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties