Key points of the article
- Silicone encapsulants represent an advanced solution for protecting electronic components in critical environments.
- Compared to organic materials, they offer advantages in terms of thermal stability, insulation, chemical resistance, and ease of processing.
- The choice between encapsulants and gels depends on the need for structure or flexibility, and the reworkability required in the production cycle.
- Dow, with its DOWSIL™ and SYLGARD™ range, offers complete solutions for every type of application requirement, with certified and versatile formulations.
- Mascherpa supports designers in selecting and validating the most suitable product, offering specialized technical consultation.
In advanced electronics, component protection is a strategic element to ensure performance, durability, and reliability. Exposure to thermal cycles, shocks, vibrations, or contaminants can compromise the functional integrity of an electronic circuit or PCB board. In this context, silicone encapsulation materials remain a reference choice for designers, engineers, and technicians working with critical devices or in challenging environments.
Silicone encapsulants and silicone gels are reliable, versatile, and high-performing solutions, distinguished by their dielectric properties, mechanical strength, and thermal stability. Mascherpa, in collaboration with Dow, provides a complete portfolio of solutions for electronic encapsulation, with products from the DOWSIL™ and SYLGARD™ range, designed to meet the specific needs of different industrial sectors.
Index
- The advantages of silicone encapsulants compared to organic materials
- Encapsulant or gel: how to choose the most suitable material
- Silicone encapsulants: structural protection and resistance
- Silicone gels: maximum stress relief and reworkability
- A portfolio designed for every application need
- Conclusion
The Advantages of Silicone Encapsulants Compared to Organic Materials
Unlike epoxy or urethane-based solutions, silicone encapsulants offer numerous technical advantages:
- Thermal stability across a wide temperature range (-45°C / +200°C)
- High elasticity to absorb thermal expansion without stressing the component
- Advanced protection against moisture, UV radiation, chemical agents
- Excellent electrical insulation and dielectric properties
- Simple processability, even without primers, and without exothermic reactions
These characteristics make silicones ideal for critical environments such as automotive, aerospace, industrial, lighting, or telecommunications. Not surprisingly, Dow has been recognized for over 70 years as a global reference in electronics encapsulants, with a range of over 7,000 tested and reliable silicone solutions.
Encapsulant or Gel: how to Choose the most Suitable Material
Silicone Encapsulants: Structural Protection and Resistance
Two-component addition-curing silicone encapsulants are formulated to provide durable mechanical protection. They are used when the following is required:
- A durable and resistant structure
- Thermal management through conductive materials
- Adhesion to metal or plastic substrates, even without primers
- Complete module insulation, even in high thicknesses
The DOWSIL™ range includes products for every need, from low-viscosity formulations for rapid cycles to encapsulants with high Shore A hardness for aggressive environments.
Application examples:
- DOWSIL™ CN-8760 G: reworkable thermally conductive encapsulant
- SYLGARD™ 160: elastomer with high thermal stability
- DOWSIL™ SE 1816 CV: black encapsulant with long pot-life
Silicone Gels: Maximum Stress Relief and Reworkability
Silicone gels represent the ideal solution for applications requiring flexibility, self-healing properties, and ease of intervention. Thanks to their viscoelastic nature, gels:
- Absorb mechanical stress without transferring it to the component
- Naturally adhere to surfaces without the need for primers
- Allow module reworkability
- Offer excellent dielectric properties
Some examples:
- DOWSIL™ 3-4155 HV: dielectric gel for low temperatures down to -80°C
- SYLGARD™ 527: standard gel with high penetration
- DOWSIL™ EG-3000: thixotropic gel for selective protection
A Portfolio Designed for Every Application Need
DOWSIL encapsulants and DOWSIL gels offer an extensive range of:
- Viscosity (from 260 to 65,000 mPa·s)
- Hardness (from Shore 00 to Shore A >60)
- Flexible processing and curing times
- Certifications (UL 94 V-0, MIL-SPEC, EN 45545)
Options are also available with:
- Rapid UV curing
- High transparency for optical applications
- Resistance to fuels and solvents
- Compliance with space standards
Thanks to the variety of chemical-physical characteristics, designers can choose the ideal material based on PCB layout, process constraints, and long-term performance requirements.
Conclusion
Choosing silicone encapsulants means adopting a proven technology to ensure durability and performance in every industrial context. Mascherpa provides not only DOWSIL™ and SYLGARD™ products but also dedicated technical support to help companies select the most suitable material based on the actual application.
If you are evaluating an encapsulation or protection solution for electronics, contact Mascherpa experts: we will guide you in choosing, testing, and validating the best silicone gels and electronic encapsulants for your specific application.
