Tecbond 214B is a hot melt adhesive formulated using 44 percent bio-based materials, designed for use on board and cardboard. This product not only speeds up the production process, but also ensures safety and environmental sustainability.
What are hot melt adhesives?
Hot melt adhesives are a faster, cheaper and more nondestructive solution than other carton closure systems such as tape or staples. These adhesives are ideal for improving packaging applications.
A commitment to sustainability
From Tecbond ‘s efforts to become a more environmentally sustainable company, Tecbond 214B, the world’s first fully biodegradable and certified molded hot melt adhesive, was developed. A more environmentally friendly hot melt solution without compromising the quality of the adhesive.
The main features of the product
- Fast application time: Tecbond 214B stands out for its fast application and setting time, allowing more cartons to be sealed in less time, speeding up the production process;
- Non-toxic and solvent-free: This adhesive is safe to handle and use, as it contains no solvents or harmful chemicals;
- Suitable for use on cardboard and paperboard: Tecbond 214B bonds a wide range of uncoated cardboard and paper substrates, including wrap-around cartons and POS display boxes.
The advantages
The advantages of Tecbond 214B are numerous:
- Production efficiency: fast and accurate sealing, reducing time and increasing productivity;
- Safety: completely free of solvents and harmful chemicals, safe for operators;
- Versatility: suitable for a wide range of applications on board and cardboard;
- Sustainability: biodegradable under natural environmental conditions, helping to reduce environmental impact and promoting environmentally sustainable packaging practices.
The Tecbond 214B degradation process.
Decomposition of Tecbond 214B can occur due to environmental conditions, namely through the combined action of UV light, oxygen and heat, which trigger the breakdown of long-chain polymers within the adhesive. After initial exposure to UV light, oxygen and heat, the adhesive requires only the continuous presence of oxygen to continue to degrade. Another mode of decomposition occurs through consumption by certain microorganisms as natural wastes. The degradation process leaves behind only non-harmful products without microplastics. Tecbond 214B is certified according to ASTM D6400, EN13432, ASTM D6954 and ASTM D6866 standards.
Conclusion
Choosing Tecbond 214B means investing in a packaging solution that combines outstanding performance and environmental sustainability. This hot melt adhesive, thanks to its 44 percent formulation with bio-based materials, not only provides a fast application and setting time, but also ensures complete biodegradability without leaving harmful residues. Tecbond 214B, therefore, represents a breakthrough for companies that wish to adopt greener practices without sacrificing the quality and efficiency of their processes.
