Electronics miniaturization refers to the production of increasingly smaller electronic products and devices and is driven by factors such as the need to increase performance and functionality, reduce size and weight, improve efficiency and cost-effectiveness, and the development of new, more compact devices such as wearable devices, medical technology, and automotive electronics. Miniaturization of electronics is essential because exponential growth in transistor density and computing power-as described by Moore’s Law-requires that electronics become smaller, faster and more energy efficient.
The role of adhesives in the miniaturization of electronic devices
Industrial adhesives play a crucial role in the miniaturization of electronic devices, enabling the assembly of thinner, lighter and more flexible devices. Specific properties offered by adhesives such as high flexibility, low thickness and the ability to adhere to dissimilar substrates are essential for miniaturization. Advancing the future of small-scale electronics, electronics-grade adhesives are able to address areas of microelectronics manufacturing that traditional techniques such as soldering cannot. Adhesives offer a precise and controlled method for attaching miniature components to PCBs and other electronic assemblies. These electronic-quality adhesives are available in various formulations with controlled viscosities, enabling the safe bonding of microscopic components, the ability to apply complex geometries with precision and control, and a level of durability that ensures long-term performance, even under harsh operating conditions.
Properties of adhesives for miniaturization in microelectronics
There are numerous properties to consider when looking for an adhesive compatible with microelectronics manufacturing and assembly, including:
- High thermal and electrical conductivity: adhesives with high thermal conductivity effectively dissipate heat in miniaturized electronic devices. Thermally conductive adhesives often contain fillers formulated to improve heat transfer;
- Low gas emission: adhesives used in microelectronics must have low gas emission to prevent contamination of sensitive electronic components. Volatile solvents are generally avoided in modern adhesive formulations;
- Precise dispensing capability: the ability to dispense adhesives accurately is crucial for the assembly of small and intricate microelectronic devices. Adhesives must have the right flow and viscosity behavior to allow accurate and controlled application;
- High temperature stability: adhesives must be able to withstand the high temperatures encountered during the manufacturing process and the operating temperatures of the final device;
- Strong adhesion and reliability: adhesives must provide robust bonding between dissimilar substrates to ensure the structural integrity and long-term reliability of microelectronic devices.
Adhesives for electronic miniaturization: the Mascherpa tips
Dowsil silicone adhesives
Dowsil offers a wide range of silicone adhesives well suited to the challenges of electronics miniaturization, including flexibility and conformability, good crack filling, and moisture resistance. The use of Dowsil silicone adhesives helps ensure strong, reliable and thermally efficient bonding of components in miniaturized electronic devices.
DOWSIL 3140
Dowsil 3140 is a one-component silicone-based adhesive that excels in various aspects of miniaturization of electronic devices. The product’s high viscosity makes 3140 ideal for applications where there may be small gaps between components that need to be filled. The high viscosity ensures that the adhesive effectively fills these cracks, creating a strong and secure bond. 3140 demonstrates excellent adhesion to a wide range of materials commonly used in electronic assembly, such as plastics and metals. This versatility simplifies the bonding process in miniaturized devices that often incorporate different materials.
DOWSIL 3145
Dowsil 3145 is also single-component and has many of the same benefits as 3140, although it has a lower viscosity that makes it easier to dispense and manipulate, potentially improving production efficiency for some applications that require more precise adhesive application. 3145 has high resistance to sagging, which means it is less likely to flow or drip during the application process, particularly when bonding components in a vertical orientation within a miniaturized device.
DOWSIL SE 9186
The Dowsil SE series is specifically formulated for demanding applications such as electronic miniaturization. SE 9186 has a low viscosity that makes it easy to dispense and manipulate, enabling more precise application during the assembly of miniature devices, which can be advantageous for situations involving delicate components or intricate bonding patterns. With a fast curing time, DOWSIL SE 9186 can improve production efficiency in miniaturization projects where faster assembly times are desired.
DOWSIL SE 9189
Dowsil SE 9189 has a higher viscosity for higher filling capacities. This is advantageous in miniaturization of electronic devices where small gaps between components need to be filled for a strong and secure bond. SE 9189 offers high chemical resistance, making it highly suitable for miniaturized devices that could be exposed to harsh chemicals during their operation or use.
Araldite epoxy adhesives
Heraldite 2011
Araldite has developed a range of epoxy adhesives well suited for electronic miniaturization applications. Araldite 2011 offers a fast cure time to improve production efficiency in miniaturization projects where faster assembly times are required. The epoxy formulation offers good strength, which means it can withstand a certain degree of stress without damage. This robustness is especially useful for miniaturized electronics that may be subject to mechanical shock or vibration during operation.
Heraldite 2012
Araldite 2012 offers slightly better moisture resistance than Araldite 2011, making it the preferred choice for miniaturized electronics that may be exposed to moisture-rich environments, protecting the bond from weakening or failure. As with Permabond UV adhesives, Araldite 2012 possesses a higher glass transition temperature, indicating that it can maintain its strength and stability at high operating temperatures.
Why choose Mascherpa
Choosing Mascherpa means relying on a trusted partner for miniaturization of electronic devices. Our industrial adhesive solutions offer high flexibility, low thickness and adhesion to dissimilar substrates, ensuring smaller, lighter and more efficient devices. The products we offer have been tested to handle mechanical stress, dissipate heat and protect against contaminants, ensuring strong and durable bonding. With advanced properties such as high thermal conductivity, low gas emission and high temperature stability, we improve production efficiency and application accuracy. In this way, Mascherpa offers advanced technology and technical expertise for high-quality solutions, ensuring superior performance and reliability for electronic miniaturization.
